Wafer World, Inc. 3509

Description
Characteristics Materials: GaAs Diameter: 150.0 Type: SI Dopant: Undoped Orientation: (100) Resistivity-Actual: >1E7 Thickness-actual: 610-660 Surface: P/P Grade: EPI Misc Info. Growth Method: VGF Lot Size: 25
  • 3509 - Wafer World, Inc.
    Wafer World, Inc.
Description
Characteristics Materials: GaAs Diameter: 150.0 Type: SI Dopant: Undoped Orientation: (100) Resistivity-Actual: >1E7 Thickness-actual: 610-660 Surface: P/P Grade: EPI Misc Info. Growth Method: VGF Lot Size: 25

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Product
Description
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- 3509 - Wafer World, Inc.
Wafer World, Inc.
West Palm Beach, FL, USA
3509
3509
Characteristics Materials: GaAs Diameter: 150.0 Type: SI Dopant: Undoped Orientation: (100) Resistivity-Actual: >1E7 Thickness-actual: 610-660 Surface: P/P Grade: EPI Misc Info. Growth Method: VGF Lot Size: 25

Characteristics Materials: GaAs Diameter: 150.0 Type: SI Dopant: Undoped Orientation: (100) Resistivity-Actual: >1E7 Thickness-actual: 610-660 Surface: P/P Grade: EPI Misc Info. Growth Method: VGF Lot Size: 25

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Technical Specifications

  Wafer World, Inc.
Product Category Semiconducting Materials
Product Number 3509
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