Wafer World, Inc. 2867

Description
Characteristics Materials: Silicon Diameter: 50.8 Type: N Dopant: As Orientation: (100) Resistivity-Actual: .001-.005 Thickness-actual: 250-300 Surface: P/E Grade: Prime Misc Info. Growth Method: CZ Lot Size: 25
  • 2867 - Wafer World, Inc.
    Wafer World, Inc.
Description
Characteristics Materials: Silicon Diameter: 50.8 Type: N Dopant: As Orientation: (100) Resistivity-Actual: .001-.005 Thickness-actual: 250-300 Surface: P/E Grade: Prime Misc Info. Growth Method: CZ Lot Size: 25

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Company
Product
Description
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- 2867 - Wafer World, Inc.
Wafer World, Inc.
West Palm Beach, FL, USA
2867
2867
Characteristics Materials: Silicon Diameter: 50.8 Type: N Dopant: As Orientation: (100) Resistivity-Actual: .001-.005 Thickness-actual: 250-300 Surface: P/E Grade: Prime Misc Info. Growth Method: CZ Lot Size: 25

Characteristics Materials: Silicon Diameter: 50.8 Type: N Dopant: As Orientation: (100) Resistivity-Actual: .001-.005 Thickness-actual: 250-300 Surface: P/E Grade: Prime Misc Info. Growth Method: CZ Lot Size: 25

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Technical Specifications

  Wafer World, Inc.
Product Category Semiconducting Materials
Product Number 2867
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