Wafer World, Inc. 2468

Description
Characteristics Materials: Silicon Diameter: 125.0 Type: P Dopant: Boron Orientation: (111) Resistivity-Actual: 1-50 Thickness-actual: 600-650 Surface: P/E Grade: Prime Misc Info. Growth Method: CZ Lot Size: 25
  • 2468 - Wafer World, Inc.
    Wafer World, Inc.
Description
Characteristics Materials: Silicon Diameter: 125.0 Type: P Dopant: Boron Orientation: (111) Resistivity-Actual: 1-50 Thickness-actual: 600-650 Surface: P/E Grade: Prime Misc Info. Growth Method: CZ Lot Size: 25

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Product
Description
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- 2468 - Wafer World, Inc.
Wafer World, Inc.
West Palm Beach, FL, USA
2468
2468
Characteristics Materials: Silicon Diameter: 125.0 Type: P Dopant: Boron Orientation: (111) Resistivity-Actual: 1-50 Thickness-actual: 600-650 Surface: P/E Grade: Prime Misc Info. Growth Method: CZ Lot Size: 25

Characteristics Materials: Silicon Diameter: 125.0 Type: P Dopant: Boron Orientation: (111) Resistivity-Actual: 1-50 Thickness-actual: 600-650 Surface: P/E Grade: Prime Misc Info. Growth Method: CZ Lot Size: 25

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Technical Specifications

  Wafer World, Inc.
Product Category Semiconducting Materials
Product Number 2468
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