Wafer World, Inc. 1923

Description
Characteristics Materials: Silicon Diameter: 200.0 Type: P Dopant: Boron Orientation: (100) Resistivity-Actual: 1-100 Thickness-actual: 600-800 Surface: P/E Grade: Test Misc Info. Growth Method: CZ Lot Size: 25
  • 1923 - Wafer World, Inc.
    Wafer World, Inc.
Description
Characteristics Materials: Silicon Diameter: 200.0 Type: P Dopant: Boron Orientation: (100) Resistivity-Actual: 1-100 Thickness-actual: 600-800 Surface: P/E Grade: Test Misc Info. Growth Method: CZ Lot Size: 25

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- 1923 - Wafer World, Inc.
Wafer World, Inc.
West Palm Beach, FL, USA
1923
1923
Characteristics Materials: Silicon Diameter: 200.0 Type: P Dopant: Boron Orientation: (100) Resistivity-Actual: 1-100 Thickness-actual: 600-800 Surface: P/E Grade: Test Misc Info. Growth Method: CZ Lot Size: 25

Characteristics Materials: Silicon Diameter: 200.0 Type: P Dopant: Boron Orientation: (100) Resistivity-Actual: 1-100 Thickness-actual: 600-800 Surface: P/E Grade: Test Misc Info. Growth Method: CZ Lot Size: 25

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Technical Specifications

  Wafer World, Inc.
Product Category Semiconducting Materials
Product Number 1923
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