Features:
Glass Passivated Chip Junction
Ultrafast Reverse Recovery Time
Low Forward Voltage Drop
Low Switching Losses, High Efficiency
High Forward Surge Capability
Solder Dip 260°C, 40 s
Component in Accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Applications: For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication.
Allied Electronics, Inc.
Done
Description
Features:
Glass Passivated Chip Junction
Ultrafast Reverse Recovery Time
Low Forward Voltage Drop
Low Switching Losses, High Efficiency
High Forward Surge Capability
Solder Dip 260°C, 40 s
Component in Accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Applications: For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication.
Features:
Glass Passivated Chip Junction
Ultrafast Reverse Recovery Time
Low Forward Voltage Drop
Low Switching Losses, High Efficiency
High Forward Surge Capability
Solder Dip 260°C, 40 s
Component in Accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Applications: For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication.
Features:
Glass Passivated Chip Junction
Ultrafast Reverse Recovery Time
Low Forward Voltage Drop
Low Switching Losses, High Efficiency
High Forward Surge Capability
Solder Dip 260°C, 40 s
Component in Accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Applications: For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication.
