Vishay Precision Group Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay THJP0612ABT1

Description
THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m. K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:4°C/W; Dielectric Strength:-; External Length:0.063"; External Width:0.126"
  • Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay - 59AJ2388 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m. K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:4°C/W; Dielectric Strength:-; External Length:0.063"; External Width:0.126"
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay - 59AJ2388 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay
59AJ2388
Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay 59AJ2388
THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m. K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:4°C/W; Dielectric Strength:-; External Length:0.063"; External Width:0.126"

THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m.K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:4°C/W; Dielectric Strength:-; External Length:0.063"; External Width:0.126"

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 59AJ2388
Product Name Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay
Thermal Conductivity 170 W/m-K (98.22 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-85 - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
T-85
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 450 F (0 to 232 C)
View Details
Thermal Pads - 1745694 - RS Components, Ltd.
RS Components, Ltd.
Thermal Pads
1745694
Specs
Chemical System Silicone
View Details
Two Component, Silver Conductive Epoxy Adhesive - EP21TDCS-LO - Master Bond, Inc.
Master Bond, Inc.
Two Component, Silver Conductive Epoxy Adhesive
EP21TDCS-LO
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Die Bonding Adhesives; Optional Premixed and Frozen; Grease, Paste; Gap Filler, Foam in Place Gasket
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details