Vishay Precision Group Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay THJP0603ABT1

Description
THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m. K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:14°C/W; Dielectric Strength:-; External Length:0.061"; External Width:0.033"
Datasheet
Description
THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m. K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:14°C/W; Dielectric Strength:-; External Length:0.061"; External Width:0.033"
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay - 59AJ2386 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay
59AJ2386
Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay 59AJ2386
THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m. K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:14°C/W; Dielectric Strength:-; External Length:0.061"; External Width:0.033"

THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m.K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:14°C/W; Dielectric Strength:-; External Length:0.061"; External Width:0.033"

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 59AJ2386
Product Name Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay
Thermal Conductivity 170 W/m-K (98.22 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications - MasterSil 973S-LO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Addition Cure
Form / Shape Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
Chemical System Silicone
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Heat Transfer Compound - T-3 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 850 F (0 to 454 C)
View Details
RS Components, Ltd.
Specs
Use Temperature -40 to 392 F (-40 to 200 C)
Thermal Conductivity 4 W/m-K (2.31 BTU-ft/hr-ft²-F)
View Details