A homogeneous film of metal alloy is deposited on a high grade ceramic body. After a helical grove has been cut in the resistive layer, tinned connecting leads of electrolytic copper are welded to the end-caps. The resistors are coated with a colored lacquer which provides electrical, mechanical and climatic protection. The encapsulation is resistant to all cleaning solvents in accordance with IEC 60068-2-45. Features:
Tolerance: ±1%
Low Noise (Max 1.5 μV/V for R > 1M Ohm
Small Size
Pure Tin Plating Provides Compatibility with Lead (Pb)-Free and Lead Containing Soldering Processes Applications:
General Purpose Resistors
A homogeneous film of metal alloy is deposited on a high grade ceramic body. After a helical grove has been cut in the resistive layer, tinned connecting leads of electrolytic copper are welded to the end-caps. The resistors are coated with a colored lacquer which provides electrical, mechanical and climatic protection. The encapsulation is resistant to all cleaning solvents in accordance with IEC 60068-2-45.
Features:
- Tolerance: ±1%
- Low Noise (Max 1.5 μV/V for R > 1M Ohm
- Small Size
- Pure Tin Plating Provides Compatibility with Lead (Pb)-Free and Lead Containing Soldering Processes
Applications:
- General Purpose Resistors
