Vishay Intertechnology, Inc. Res Wirewound 5.6K Ohm 5% 8W ¦30ppm/¦C RDL Thru-Hole Foam Pack HLW06R1Z5K600JF

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Res Wirewound 5.6K Ohm 5% 8W ¦30ppm/¦C RDL Thru-Hole Foam Pack

ASAP Semiconductor LLC

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Description

Res Wirewound 5.6K Ohm 5% 8W ¦30ppm/¦C RDL Thru-Hole Foam Pack

Request a Quote

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ASAP Semiconductor LLC

Anaheim, CA, United States

Res Wirewound 5.6K Ohm 5% 8W ¦30ppm/¦C RDL Thru-Hole Foam Pack
HLW06R1Z5K600JF

Res Wirewound 5.6K Ohm 5% 8W ¦30ppm/¦C RDL Thru-Hole Foam Pack HLW06R1Z5K600JF

Res Wirewound 5.6K Ohm 5% 8W ¦30ppm/¦C RDL Thru-Hole Foam Pack

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Technical Specifications

	ASAP Semiconductor LLC
Product Category	Resistors
Product Number	HLW06R1Z5K600JF
Product Name	Res Wirewound 5.6K Ohm 5% 8W ¦30ppm/¦C RDL Thru-Hole Foam Pack
Technology / Construction	Wirewound

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