Vishay Intertechnology, Inc. Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack HLW05R2Z8K250JF

Description

Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack

ASAP Semiconductor LLC

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Description

Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack

Request a Quote

Email Supplier

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Description

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ASAP Semiconductor LLC

Anaheim, CA, United States

Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack
HLW05R2Z8K250JF

Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack HLW05R2Z8K250JF

Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack

Supplier's Site

Technical Specifications

	ASAP Semiconductor LLC
Product Category	Resistors
Product Number	HLW05R2Z8K250JF
Product Name	Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack
Technology / Construction	Wirewound

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