Vishay Intertechnology, Inc. Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack HLW05R2Z8K250JF

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Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack
  • Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack - HLW05R2Z8K250JF - ASAP Semiconductor LLC
    ASAP Semiconductor LLC
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Description
Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack
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Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack - HLW05R2Z8K250JF - ASAP Semiconductor LLC
ASAP Semiconductor LLC
Anaheim, CA, United States
Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack
HLW05R2Z8K250JF
Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack HLW05R2Z8K250JF
Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack

Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack

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Technical Specifications

  ASAP Semiconductor LLC
Product Category Resistors
Product Number HLW05R2Z8K250JF
Product Name Res Wirewound 8.25K Ohm 5% 5.25W ¦30ppm/¦C RDL Thru-Hole Foam Pack
Technology / Construction Wirewound
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