Features:
Superectifier Structure for High Reliability Application
Cavity-Free Glass-Passivated Junction
Low Forward Voltage Drop
Low Leakage Current, IR Less Than 0.1 μA
High Forward Surge Capability
Meets Environmental Standard MIL-S-19500
Solder Dip 260°C, 40 s
Component in Accordance to RoHS 2002/95/ECand WEEE 2002/96/EC Applications: For use in general-purpose rectification of power supplies, inverters, converters and freewheeling diodes application.
Allied Electronics, Inc.
Done
Description
Features:
Superectifier Structure for High Reliability Application
Cavity-Free Glass-Passivated Junction
Low Forward Voltage Drop
Low Leakage Current, IR Less Than 0.1 μA
High Forward Surge Capability
Meets Environmental Standard MIL-S-19500
Solder Dip 260°C, 40 s
Component in Accordance to RoHS 2002/95/ECand WEEE 2002/96/EC Applications: For use in general-purpose rectification of power supplies, inverters, converters and freewheeling diodes application.
Features:
Superectifier Structure for High Reliability Application
Cavity-Free Glass-Passivated Junction
Low Forward Voltage Drop
Low Leakage Current, IR Less Than 0.1 μA
High Forward Surge Capability
Meets Environmental Standard MIL-S-19500
Solder Dip 260°C, 40 s
Component in Accordance to RoHS 2002/95/ECand WEEE 2002/96/EC Applications: For use in general-purpose rectification of power supplies, inverters, converters and freewheeling diodes application.
Features:
Superectifier Structure for High Reliability Application
Cavity-Free Glass-Passivated Junction
Low Forward Voltage Drop
Low Leakage Current, IR Less Than 0.1 μA
High Forward Surge Capability
Meets Environmental Standard MIL-S-19500
Solder Dip 260°C, 40 s
Component in Accordance to RoHS 2002/95/ECand WEEE 2002/96/EC Applications:
For use in general-purpose rectification of power supplies, inverters, converters and freewheeling diodes application.
