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Umicore Galvanotechnik GmbH DIG process DIG process

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DIG process - DIG process - Umicore Galvanotechnik GmbH
Schwaebisch Gmuend, Germany
DIG process DIG process
Plating of direct immersion gold Ever increasing electric components density and high frequencies of signal transmission require new concepts of final finishes in PCB manufacturing, too. By direct gold plating on copper (DIG) beside ISIG and EPIG a further process has been provided, which is free from nickel and has a high HF performance. Due to its outstanding film characteristics DIG deposits are very well suited to withstand the higher requirements of PCB designers concerning fine pattern ability and high performance regarding soldering and wire bonding. Advantages Nickel free coating Deposits with high HF performance Suitable for (ultra) fine pitch layouts Ductile film compatible for flex PCB applications Dense and homogenous gold protection layer up to 0.3 μm feasible High solderjoint reliability (SJR) due to low void formation Excellent Al-, Au-, Cu-(Pd coated) and Ag-wire bondability Low plating cost due to few process steps Applications Flexboard PCB (FPC) Multi-functional assembly Fine pattern PCB design
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Technical Specifications

  Umicore Galvanotechnik GmbH
Product Category Plating Services
Product Number DIG process
Product Name DIG process
Company Information

Umicore is a leading circular materials technology company with an extensive expertise in the fields of material science, chemistry and metallurgy. Our overriding goal of sustainable value creation is based on the ambition to develop, produce and recycle materials in a way that fulfils our mission: "materials for a better life".

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