Trilion Quality Systems ESPI

Description
The 3D Laser ESPI System (laser holography) measures in and out-of-plane displacements and strain very precisely using laser interferometry. It is used in a broad variety of applications from fatigue tests to general strain measurement and analysis. The interferometric method ESPI is well suited to measure the smallest 3D displacements and plane strain with resolutions of approximately 10 nanometers or 1 micrometer per meter. The ESPI system includes a high quality digital CCD camera with computer-controlled shutter time, one or multiple laser sources, a computer controlled phase shift device, the needed optic and the needed electronic driver and the data acquisition and treatment system, integrated in the PC. The laser light is directed onto the object under test and the camera grabs the resulting speckled image. Object deformations in the sub-micrometers range modify the image gathered by the CCD camera. Using appropriate image treatment, the difference between the two images shows up with black interference fringes (real time viewing of the actual deformation). Common uses include: - Deflection, strain, thermal expansion and residual stress measurements - FEA validation - Determining the linear behavior, even of brittle materials - Characterizing heterogeneous materials - Characterizing the transition range of two different materials - Quality control of honeycomb and sandwich structures

Suppliers

Company
Product
Description
Supplier Links
ESPI -  - Trilion Quality Systems
Plymouth Meeting, PA, USA
ESPI
ESPI
The 3D Laser ESPI System (laser holography) measures in and out-of-plane displacements and strain very precisely using laser interferometry. It is used in a broad variety of applications from fatigue tests to general strain measurement and analysis. The interferometric method ESPI is well suited to measure the smallest 3D displacements and plane strain with resolutions of approximately 10 nanometers or 1 micrometer per meter. The ESPI system includes a high quality digital CCD camera with computer-controlled shutter time, one or multiple laser sources, a computer controlled phase shift device, the needed optic and the needed electronic driver and the data acquisition and treatment system, integrated in the PC. The laser light is directed onto the object under test and the camera grabs the resulting speckled image. Object deformations in the sub-micrometers range modify the image gathered by the CCD camera. Using appropriate image treatment, the difference between the two images shows up with black interference fringes (real time viewing of the actual deformation). Common uses include: - Deflection, strain, thermal expansion and residual stress measurements - FEA validation - Determining the linear behavior, even of brittle materials - Characterizing heterogeneous materials - Characterizing the transition range of two different materials - Quality control of honeycomb and sandwich structures

The 3D Laser ESPI System (laser holography) measures in and out-of-plane displacements and strain very precisely using laser interferometry. It is used in a broad variety of applications from fatigue tests to general strain measurement and analysis. The interferometric method ESPI is well suited to measure the smallest 3D displacements and plane strain with resolutions of approximately 10 nanometers or 1 micrometer per meter.

The ESPI system includes a high quality digital CCD camera with computer-controlled shutter time, one or multiple laser sources, a computer controlled phase shift device, the needed optic and the needed electronic driver and the data acquisition and treatment system, integrated in the PC.
The laser light is directed onto the object under test and the camera grabs the resulting speckled image. Object deformations in the sub-micrometers range modify the image gathered by the CCD camera. Using appropriate image treatment, the difference between the two images shows up with black interference fringes (real time viewing of the actual deformation).

Common uses include:

- Deflection, strain, thermal expansion and residual stress measurements
- FEA validation
- Determining the linear behavior, even of brittle materials
- Characterizing heterogeneous materials
- Characterizing the transition range of two different materials
- Quality control of honeycomb and sandwich structures

Supplier's Site

Technical Specifications

  Trilion Quality Systems
Product Category Dimensional Gages and Instruments
Product Name ESPI
Unlock Full Specs
to access all available technical data

Similar Products

Micrometer Head, High Resolution, 0.5 µm Sensitivity, 6 mm Travel - HR-6 - Newport MKS
Specs
Mounting / Loading Options 3/8-40
Measurement Scale / Units Metric
Gage / Instrument Type Micrometer
View Details
 - 2643586 - RS Components, Ltd.
RS Components, Ltd.
Specs
Gage / Instrument Type Bore Gage
Range 0.3150 to 5.91 inch (8 to 150 mm)
View Details
Dial Indicator - D-R / D-L / D-C - Imao-Fixtureworks
Specs
Measurement Scale / Units Metric
Gage / Instrument Type Indicator / Comparator
View Details
Precision Gage - AG-400 - Sunnen Products Company
Sunnen Products Company
Specs
Mounting / Loading Options Benchtop or Floor
Measurement Scale / Units Metric
Gage / Instrument Type Bore Gage
View Details