Bostik, Inc. Bostik Thermogrip® 1378 Hot Melt Adhesive Black 35 lb Case H1378-BBL

Description
Bostik Thermogrip® 1378 Black is a hot melt adhesive designed for bonding difficult substrates like asfluorocarbon-treat ed board stock in carton sealing applications. 35 lb Case.
Request a Quote Datasheet
Description
Bostik Thermogrip® 1378 Black is a hot melt adhesive designed for bonding difficult substrates like asfluorocarbon-treat ed board stock in carton sealing applications. 35 lb Case.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Bostik Thermogrip® 1378 Hot Melt Adhesive Black 35 lb Case - H1378-BBL - Ellsworth Adhesives
Germantown, WI, USA
Bostik Thermogrip® 1378 Hot Melt Adhesive Black 35 lb Case
H1378-BBL
Bostik Thermogrip® 1378 Hot Melt Adhesive Black 35 lb Case H1378-BBL
Bostik Thermogrip® 1378 Black is a hot melt adhesive designed for bonding difficult substrates like asfluorocarbon-treat ed board stock in carton sealing applications. 35 lb Case.

Bostik Thermogrip® 1378 Black is a hot melt adhesive designed for bonding difficult substrates like asfluorocarbon-treated board stock in carton sealing applications. 35 lb Case.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Sealants
Product Number H1378-BBL
Product Name Bostik Thermogrip® 1378 Hot Melt Adhesive Black 35 lb Case
Cure / Technology Thermoplastic / Hot Melt; Single Component
Unlock Full Specs
to access all available technical data

Similar Products

C-SHIELD RF Conductive Caulking Compound and Sealer -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Type / Form Liquid
Features Caulk, Grout; Electrically Conductive
View Details
Elemelt HMS702 Hot Melt Adhesive Glue Sticks Amber 0.5 in x 10 in Stick, 25 lb Case - ELEMELT HMS702-5-10A - Ellsworth Adhesives
Specs
Cure / Technology Thermoplastic / Hot Melt; Single Component
Chemical System Gum
Viscosity 48600 cP
View Details
Potting Compounds - 1991395 - RS Components, Ltd.
RS Components, Ltd.
Specs
Type / Form Liquid
Features Encapsulant, Potting Compound; Flame Retardant
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Type / Form Liquid; Sheet or Film
Features EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry Electronics; Semiconductors, IC's
View Details