Bostik, Inc. Bostik Thermogrip 6363 Hot Melt Adhesive Off-White 0.5 in x 15 in Stick, 25 lb Case 30852095

Description
Bostik Thermogrip 6363 Hot Melt Adhesive is a medium setting, general purpose glue stick that is used for assemblies and automotive applications. 0.5 in x 15 in Sticks, 25 lb Case.
Request a Quote Datasheet
Description
Bostik Thermogrip 6363 Hot Melt Adhesive is a medium setting, general purpose glue stick that is used for assemblies and automotive applications. 0.5 in x 15 in Sticks, 25 lb Case.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Bostik Thermogrip 6363 Hot Melt Adhesive Off-White 0.5 in x 15 in Stick, 25 lb Case - HM6363-F15 - Ellsworth Adhesives
Germantown, WI, USA
Bostik Thermogrip 6363 Hot Melt Adhesive Off-White 0.5 in x 15 in Stick, 25 lb Case
HM6363-F15
Bostik Thermogrip 6363 Hot Melt Adhesive Off-White 0.5 in x 15 in Stick, 25 lb Case HM6363-F15
Bostik Thermogrip 6363 Hot Melt Adhesive is a medium setting, general purpose glue stick that is used for assemblies and automotive applications. 0.5 in x 15 in Sticks, 25 lb Case.

Bostik Thermogrip 6363 Hot Melt Adhesive is a medium setting, general purpose glue stick that is used for assemblies and automotive applications. 0.5 in x 15 in Sticks, 25 lb Case.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number HM6363-F15
Product Name Bostik Thermogrip 6363 Hot Melt Adhesive Off-White 0.5 in x 15 in Stick, 25 lb Case
Cure / Technology Thermoplastic / Hot Melt; Single Component
Unlock Full Specs
to access all available technical data

Similar Products

Glues - 561664 - RS Components, Ltd.
RS Components, Ltd.
Specs
Chemical System Cyanoacrylate
Type / Form Liquid
Industry Substrate Bonding, Catplasma Test
View Details
Copper Adhesion Promoters for IC Substrates - MultiPrep 200 - MacDermid Alpha Electronics Solutions
Specs
Type / Form Sheet or Film; Liquid
Substrate Compatibility Metal; Copper adhesion promotion
Industry Electronics; Semiconductors, IC's
View Details
Transparent, Highly Flexible Epoxy Compound - EP30D-10 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy; Polyurethane
Type / Form Liquid
View Details