Bostik, Inc. Bostik Thermogrip 2109 Hot Melt Adhesive Tan 0.44 in x 10 in Stick, 25 lb Case 30852033

Description
Bostik Thermogrip 2109 Hot Melt Adhesive is a medium setting, low viscosity glue stick that bonds well to porous materials such as wood, paper, and cardboard. 7/16 in x 10 in Sticks.
Request a Quote Datasheet
Description
Bostik Thermogrip 2109 Hot Melt Adhesive is a medium setting, low viscosity glue stick that bonds well to porous materials such as wood, paper, and cardboard. 7/16 in x 10 in Sticks.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Bostik Thermogrip 2109 Hot Melt Adhesive Tan 0.44 in x 10 in Stick, 25 lb Case - HM2109-F10 - Ellsworth Adhesives
Germantown, WI, USA
Bostik Thermogrip 2109 Hot Melt Adhesive Tan 0.44 in x 10 in Stick, 25 lb Case
HM2109-F10
Bostik Thermogrip 2109 Hot Melt Adhesive Tan 0.44 in x 10 in Stick, 25 lb Case HM2109-F10
Bostik Thermogrip 2109 Hot Melt Adhesive is a medium setting, low viscosity glue stick that bonds well to porous materials such as wood, paper, and cardboard. 7/16 in x 10 in Sticks.

Bostik Thermogrip 2109 Hot Melt Adhesive is a medium setting, low viscosity glue stick that bonds well to porous materials such as wood, paper, and cardboard. 7/16 in x 10 in Sticks.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number HM2109-F10
Product Name Bostik Thermogrip 2109 Hot Melt Adhesive Tan 0.44 in x 10 in Stick, 25 lb Case
Cure / Technology Thermoplastic / Hot Melt; Single Component
Unlock Full Specs
to access all available technical data

Similar Products

High quality thermally conductive thermal gel putty - SE30 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Chemical System Silicone
Type / Form Gel
Features Thermally Conductive
View Details
Dymax Multi-Cure 6-621 UV Curing Adhesive Clear 30 mL MR Syringe - 6-621 30ML MR SYRINGE - Ellsworth Adhesives
Specs
Cure / Technology Single Component
Substrate Compatibility Ceramic, Glass; Metal
Viscosity 3500 to 25000 cP
View Details
Advanced Conductive Die Attach for Semiconductors - ATROX ® 558-2C31 - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Thermoset
Type / Form Sheet or Film
Features Electrically Conductive; Thermally Conductive
View Details