Bostik, Inc. Bostik Thermogrip 2109 Hot Melt Adhesive Tan 0.44 in x 10 in Stick, 25 lb Case 30852033

Description
Bostik Thermogrip 2109 Hot Melt Adhesive is a medium setting, low viscosity glue stick that bonds well to porous materials such as wood, paper, and cardboard. 7/16 in x 10 in Sticks.
Request a Quote Datasheet
Description
Bostik Thermogrip 2109 Hot Melt Adhesive is a medium setting, low viscosity glue stick that bonds well to porous materials such as wood, paper, and cardboard. 7/16 in x 10 in Sticks.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Bostik Thermogrip 2109 Hot Melt Adhesive Tan 0.44 in x 10 in Stick, 25 lb Case - HM2109-F10 - Ellsworth Adhesives
Germantown, WI, USA
Bostik Thermogrip 2109 Hot Melt Adhesive Tan 0.44 in x 10 in Stick, 25 lb Case
HM2109-F10
Bostik Thermogrip 2109 Hot Melt Adhesive Tan 0.44 in x 10 in Stick, 25 lb Case HM2109-F10
Bostik Thermogrip 2109 Hot Melt Adhesive is a medium setting, low viscosity glue stick that bonds well to porous materials such as wood, paper, and cardboard. 7/16 in x 10 in Sticks.

Bostik Thermogrip 2109 Hot Melt Adhesive is a medium setting, low viscosity glue stick that bonds well to porous materials such as wood, paper, and cardboard. 7/16 in x 10 in Sticks.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number HM2109-F10
Product Name Bostik Thermogrip 2109 Hot Melt Adhesive Tan 0.44 in x 10 in Stick, 25 lb Case
Cure / Technology Thermoplastic / Hot Melt; Single Component
Unlock Full Specs
to access all available technical data

Similar Products

Formulations - Applications - Bonding - Tuffbond 315 - 3315AB22 - Hernon Manufacturing, Inc.
Specs
Chemical System Ceramic; Epoxy
Features Encapsulant, Potting Compound
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Heat Transfer Compound - T-99 - Thermon, Inc
Specs
Cure / Technology Single Component
Features Thermally Conductive
Use Temperature 32 to 2200 F (0 to 1204 C)
View Details
Adhesives -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Cure / Technology Two Component  
Chemical System Epoxy; Silicone
View Details