Toshiba Corporation 512GB Memory IC and Storage Component THNSN5512GPU7

Description
512GB SSD M.2-2280 XG3 NVMe 3.0 Product overview: THNSN5512GPU7 from Toshiba Electronic Devices and Storage Corporation is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 512GB. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 512GB, Memory IC and Storage Component, SSDs, HDDs. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 503-THNSN5512GPU7 can be used for catalog matching and distributor lookup.
Request a Quote
Description
512GB SSD M.2-2280 XG3 NVMe 3.0 Product overview: THNSN5512GPU7 from Toshiba Electronic Devices and Storage Corporation is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 512GB. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 512GB, Memory IC and Storage Component, SSDs, HDDs. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 503-THNSN5512GPU7 can be used for catalog matching and distributor lookup.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
512GB Memory IC and Storage Component - 503-THNSN5512GPU7 - ERSAELECTRONICS PTE. LTD.
Singapore, Singapore
512GB Memory IC and Storage Component
503-THNSN5512GPU7
512GB Memory IC and Storage Component 503-THNSN5512GPU7
512GB SSD M.2-2280 XG3 NVMe 3.0 Product overview: THNSN5512GPU7 from Toshiba Electronic Devices and Storage Corporation is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 512GB. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 512GB, Memory IC and Storage Component, SSDs, HDDs. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 503-THNSN5512GPU7 can be used for catalog matching and distributor lookup.

512GB SSD M.2-2280 XG3 NVMe 3.0 Product overview: THNSN5512GPU7 from Toshiba Electronic Devices and Storage Corporation is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 512GB. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 512GB, Memory IC and Storage Component, SSDs, HDDs. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 503-THNSN5512GPU7 can be used for catalog matching and distributor lookup.

Supplier's Site

Technical Specifications

  ERSAELECTRONICS PTE. LTD.
Product Category Memory Chips
Product Number 503-THNSN5512GPU7
Product Name 512GB Memory IC and Storage Component
Unlock Full Specs
to access all available technical data

Similar Products

Memory - AS5SP128K32 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category SSRAM; SRAM Chip
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 1024 kbits
View Details
Memory IC and Storage Component - 736-DP8421AVX-25 - ERSAELECTRONICS PTE. LTD.
Specs
Memory Category DRAM Chip
Operating Temperature 0 C (32 F)
Package Type LCC
View Details
4 suppliers
Flash Memory - 1882527 - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category Flash
Bits per Word 8 bits
Package Type SOIC
View Details