The 1352755-TDA4VM88TGBALFR is an integrated circuit from Texas Instruments, designed as a System on Chip (SoC) for automotive applications, particularly in advanced driver-assistance systems (ADAS) and autonomous vehicles. It features dual ARM Cortex-A72 processors operating at up to 2.0 GHz, along with multiple ARM Cortex-R5F microcontrollers and high-performance DSP cores, enabling efficient processing for both traditional and deep learning algorithms. This SoC supports a wide range of connectivity options, including multiple PCIe Gen3 controllers, USB 3.0, and Ethernet interfaces, making it suitable for applications requiring high data throughput. It is equipped with dedicated hardware accelerators for vision processing, deep learning, and video encoding/decoding, supporting resolutions up to Ultra-HD. The device is designed with functional safety in mind, targeting compliance with ISO 26262 up to ASIL-D and IEC 61508 up to SIL-3, making it appropriate for safety-critical applications. It operates within a temperature range of -40¬8C to 105¬8C and is packaged in a 827-BFBGA format, facilitating integration into compact designs. The TDA4VM processor family is particularly well-suited for applications in robotics, machine vision, and smart retail environments.
Win Source Part Number: 1352755-TDA4VM88TGBA
Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Temperature Range - Operating: -40°C ~ 105°C (TJ)
Fake Threat In the Open Market: 46 pct.
MSL Level: 3 (168 Hours)
Mfr: Texas Instruments
Series: Automotive, AEC-Q100
Package: Tape & Reel
Product Status: Active
Package / Case: 827-BFBGA, FCBGA
Supplier Device Package: 827-FCBGA (24x24)
HTSUS: 8542.31.0001
ECCN: 5A992C
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
Number of I/O: 226
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SDSD/IOI²C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
RAM Size: 1.5MB
Architecture: DSP, MCU, MPU
NEXT GENERATION SOC FAMILY FOR L
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x System On Chip (SOC) IC Automotive, AEC-Q100 2GHz, 1GHz, 1.35GHz, 1GHz 827-FCBGA (24x24)
NEXT GENERATION SOC FAMILY FOR L
NEXT GENERATION SOC FAMILY FOR L
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x System On Chip (SOC) IC Automotive, AEC-Q100 2GHz, 1GHz, 1.35GHz, 1GHz 827-FCBGA (24x24)
NEXT GENERATION SOC FAMILY FOR L
| Win Source Electronics | DigiKey | Shenzhen Shengyu Electronics Technology Limited | Quarktwin Technology Ltd. | Lingto Electronic Limited | |
|---|---|---|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | 1352755-TDA4VM88TGBALFR | 296-TDA4VM88TGBALFRDKR-ND | TDA4VM88TGBALFR | TDA4VM88TGBALFR | TDA4VM88TGBALFR |
| Product Name | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) | System On Chip (SoC) | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) | System On Chip (SoC) | Embedded - System On Chip (SoC) |
| Processor Core | ARM | ARM | ARM | ARM; ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | ARM; ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x |
| Package / Case | Tape & Reel | 827-BFBGA, FCBGA | 827-BFBGA, FCBGA | ||
| RAM Size | 1.5 MB | 1.5 MB | 1.5 MB | 1.5 MB | |
| Number of Inputs/Outputs | 226 # | 226 # |