The 66AK2L06XCMS2 is a multicore System-on-Chip (SoC) from Texas Instruments, featuring a combination of four TMS320C66x DSP cores and two ARM Cortex-A15 processors. It operates at frequencies of up to 1.2 GHz, providing significant computational power with a performance of 38.4 GMacs per core for fixed-point operations and 19.2 GFlops per core for floating-point operations. The device supports a variety of applications, including medical, avionics, and industrial sectors, thanks to its integrated Digital Front End (DFE) and high-speed connectivity options. The SoC includes a robust memory architecture with up to 6.4 Gbps IPSec support, 32K bytes of L1 cache per DSP core, and 2 MB of shared SRAM. It also features a 4-port Gigabit Ethernet switch, multiple high-speed interfaces including PCIe Gen2, and a comprehensive set of peripherals such as UART, I¬=C, and SPI. The device is designed for low power consumption while meeting stringent size and cost requirements, making it suitable for applications that require efficient signal processing and control. The operating temperature range is from -40¬8C to 100¬8C, ensuring reliability in diverse environments.
IC SOC MULTICORE DSP+ARM 900BGA
IC SOC MULTICORE DSP+ARM 900BGA
IC SOC MULTICORE DSP+ARM 900BGA
| DigiKey | Lingto Electronic Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|
| Product Category | Digital Signal Processors (DSP) | Digital Signal Processors (DSP) | Digital Signal Processors (DSP) |
| Product Number | 66AK2L06XCMS2-ND | 66AK2L06XCMS2 | 66AK2L06XCMS2 |
| Product Name | DSP (Digital Signal Processors) | Embedded - DSP (Digital Signal Processors) | DSP (Digital Signal Processors) |
| Supply Voltage | 1.8V; 3.3V | ||
| Package Type | Other; 900-BFBGA, FCBGA | BGA; Other; 900-BFBGA, FCBGA | |
| Pin Count | 900 |