Texas Instruments High-Performance Analog DSP (Digital Signal Processors) 66AK2L06XCMS2

Description
IC SOC MULTICORE DSP+ARM 900BGA
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Description
IC SOC MULTICORE DSP+ARM 900BGA
Request a Quote
Datasheet
Datasheet Summary
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The 66AK2L06XCMS2 is a multicore System-on-Chip (SoC) from Texas Instruments, featuring a combination of four TMS320C66x DSP cores and two ARM Cortex-A15 processors. It operates at frequencies of up to 1.2 GHz, providing significant computational power with a performance of 38.4 GMacs per core for fixed-point operations and 19.2 GFlops per core for floating-point operations. The device supports a variety of applications, including medical, avionics, and industrial sectors, thanks to its integrated Digital Front End (DFE) and high-speed connectivity options. The SoC includes a robust memory architecture with up to 6.4 Gbps IPSec support, 32K bytes of L1 cache per DSP core, and 2 MB of shared SRAM. It also features a 4-port Gigabit Ethernet switch, multiple high-speed interfaces including PCIe Gen2, and a comprehensive set of peripherals such as UART, I¬=C, and SPI. The device is designed for low power consumption while meeting stringent size and cost requirements, making it suitable for applications that require efficient signal processing and control. The operating temperature range is from -40¬8C to 100¬8C, ensuring reliability in diverse environments.

Datasheet Summary
Powered by GS/AI

The 66AK2L06XCMS2 is a multicore System-on-Chip (SoC) from Texas Instruments, featuring a combination of four TMS320C66x DSP cores and two ARM Cortex-A15 processors. It operates at frequencies of up to 1.2 GHz, providing significant computational power with a performance of 38.4 GMacs per core for fixed-point operations and 19.2 GFlops per core for floating-point operations. The device supports a variety of applications, including medical, avionics, and industrial sectors, thanks to its integrated Digital Front End (DFE) and high-speed connectivity options. The SoC includes a robust memory architecture with up to 6.4 Gbps IPSec support, 32K bytes of L1 cache per DSP core, and 2 MB of shared SRAM. It also features a 4-port Gigabit Ethernet switch, multiple high-speed interfaces including PCIe Gen2, and a comprehensive set of peripherals such as UART, I¬=C, and SPI. The device is designed for low power consumption while meeting stringent size and cost requirements, making it suitable for applications that require efficient signal processing and control. The operating temperature range is from -40¬8C to 100¬8C, ensuring reliability in diverse environments.

Suppliers

Company
Product
Description
Supplier Links
DSP (Digital Signal Processors) - 66AK2L06XCMS2-ND - DigiKey
Thief River Falls, MN, United States
DSP (Digital Signal Processors)
66AK2L06XCMS2-ND
DSP (Digital Signal Processors) 66AK2L06XCMS2-ND
IC SOC MULTICORE DSP+ARM 900BGA

IC SOC MULTICORE DSP+ARM 900BGA

Buy Now Datasheet
Embedded - DSP (Digital Signal Processors) - 66AK2L06XCMS2 - Lingto Electronic Limited
Shenzhen, China
Embedded - DSP (Digital Signal Processors)
66AK2L06XCMS2
Embedded - DSP (Digital Signal Processors) 66AK2L06XCMS2
IC SOC MULTICORE DSP+ARM 900BGA

IC SOC MULTICORE DSP+ARM 900BGA

Supplier's Site Datasheet
DSP (Digital Signal Processors) - 66AK2L06XCMS2 - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
DSP (Digital Signal Processors)
66AK2L06XCMS2
DSP (Digital Signal Processors) 66AK2L06XCMS2
IC SOC MULTICORE DSP+ARM 900BGA

IC SOC MULTICORE DSP+ARM 900BGA

Buy Now Datasheet

Technical Specifications

  DigiKey Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category Digital Signal Processors (DSP) Digital Signal Processors (DSP) Digital Signal Processors (DSP)
Product Number 66AK2L06XCMS2-ND 66AK2L06XCMS2 66AK2L06XCMS2
Product Name DSP (Digital Signal Processors) Embedded - DSP (Digital Signal Processors) DSP (Digital Signal Processors)
Supply Voltage 1.8V; 3.3V
Package Type Other; 900-BFBGA, FCBGA BGA; Other; 900-BFBGA, FCBGA
Pin Count 900
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