The HE910 is our most compact multi-band HSPA+ LGA module series, with built-in GPS and GSM/EGPRS fallback at 28x28mm. As a member of the xE910 LGA unified form factor family the HE910 series is pin-to-pin compatible with LTE, HSPA, GSM/GPRS and CDMA/EVDO xE910 family counterparts. Featuring seven-band HSPA+ data rates of up to 21 Mbps (Cat 14) downlink and 5.7 Mbps (Cat 6) uplink, ideal for high performance global roaming.
The HE910 series is well-suited for a wide range of industrial and consumer applications with high data throughput requirements, including, asset & fleet tracking, in-car telematics, PDAs, security surveillance, personal navigation devices, e-readers and consumer electronics in general. Several variants are offered, ranging from low cost tri-band models with reduced throughput, to fully-loaded configurations including receiver diversity and high sensitivity A-GPS functionality.
Seven-band HSPA+ for worldwide coverage
Design once and deploy globally, thanks to xE910 unified form factor
LGA package ideally suited for low profile integrated solutions, reducing cost in high-volume applications, as well as saving space and weight in portable devices
Optional GPS ideal for applications requiring indoor fixes and simultaneous GPS with voice and data
Perfect platform for a wide range of applications requiring HSPA connectivity
The xE910 Unified Form Factor family is comprised of pin-to-pin compatible modules in Telit's broadest range of cellular air interfaces and band combinations making it a pillar of the concept "design once and deploy globally". A one-time design and integration effort enables worldwide or regional device re-use across different data rates and wireless technologies with air interfaces in GSM/GPRS, UMTS/HSPA+, 1xRTT, EV-DO, and LTE (pre-release). The xE910 family was conceived to enable applications to be easily upgraded in a number of ways. For example: migrating from 2G to 3G or 4G; or upgrading from 2 bands to 3, 4, or more. The family fully preserves the core design of the application or device from launch to phase-out with modules packaged in a common 28.2x28.2 mm LGA footprint. It is recommended for mid to high-volume, compact sized applications.