Teledyne Relays RF Relay S114-12

Description
The series S114 Surface Mount Centigrid® Relay is an ultraminiature, hermetically sealed, armature relay. The low profile height (0.360"") and 0.100"" lead spacing make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The specially formed leads are pre-tinned to make the relays ideal for most types of surface mount solder reflow processes. The basic design and internal construction are identical to the series 114 Centigrid® relays, and are capable of meeting Teledyne Relay's T2R® requirements.
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Description
The series S114 Surface Mount Centigrid® Relay is an ultraminiature, hermetically sealed, armature relay. The low profile height (0.360"") and 0.100"" lead spacing make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The specially formed leads are pre-tinned to make the relays ideal for most types of surface mount solder reflow processes. The basic design and internal construction are identical to the series 114 Centigrid® relays, and are capable of meeting Teledyne Relay's T2R® requirements.
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Suppliers

Company
Product
Description
Supplier Links
RF Relay - S114-12 - Richardson RFPD
Downers Grove, IL, United States
RF Relay
S114-12
RF Relay S114-12
The series S114 Surface Mount Centigrid® Relay is an ultraminiature, hermetically sealed, armature relay. The low profile height (0.360"") and 0.100"" lead spacing make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The specially formed leads are pre-tinned to make the relays ideal for most types of surface mount solder reflow processes. The basic design and internal construction are identical to the series 114 Centigrid® relays, and are capable of meeting Teledyne Relay's T2R® requirements.

The series S114 Surface Mount Centigrid® Relay is an ultraminiature, hermetically sealed, armature relay. The low profile height (0.360"") and 0.100"" lead spacing make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The specially formed leads are pre-tinned to make the relays ideal for most types of surface mount solder reflow processes. The basic design and internal construction are identical to the series 114 Centigrid® relays, and are capable of meeting Teledyne Relay's T2R® requirements.

Supplier's Site

Technical Specifications

  Richardson RFPD
Product Category Electromechanical Relays
Product Number S114-12
Product Name RF Relay
Mounting Centigrid, SMT
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