MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp melting/solidificati
on point, which results in robust and reliable joints that are highly resistant to whisker formation.
MG 4886 is fast wetting, fast flowing, non-corrosive and non-conductive. Please note this grade is REACH compliant however not RoHS compliant due to lead content.
Product Benefits
Eutectic alloy (liquidus = solidus temperature)
Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
Flux meets J-STD-004B
Rosin-activated flux
Fast wetting
Fast flowing
Non-corrosive residue
Non-conductive residue
MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.
MG 4886 is fast wetting, fast flowing, non-corrosive and non-conductive. Please note this grade is REACH compliant however not RoHS compliant due to lead content.
Product Benefits
- Eutectic alloy (liquidus = solidus temperature)
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Rosin-activated flux
- Fast wetting
- Fast flowing
- Non-corrosive residue
- Non-conductive residue
