Techsil Limited MG Chemicals 4884 Solder Wire Silver 0.025" Dia. MGEN00012

Description
MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp melting/solidificati on point, which results in robust and reliable joints that are highly resistant to whisker formation. MG 4884 is fast wetting, fast flowing, non-corrosive and non-conductive. Please note this grade is REACH compliant however not RoHS compliant due to lead content. Product Benefits Eutectic alloy (liquidus = solidus temperature) Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements Flux meets J-STD-004B Rosin-activated flux Fast wetting Fast flowing Non-corrosive residue Non-conductive residue
Datasheet
Description
MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp melting/solidificati on point, which results in robust and reliable joints that are highly resistant to whisker formation. MG 4884 is fast wetting, fast flowing, non-corrosive and non-conductive. Please note this grade is REACH compliant however not RoHS compliant due to lead content. Product Benefits Eutectic alloy (liquidus = solidus temperature) Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements Flux meets J-STD-004B Rosin-activated flux Fast wetting Fast flowing Non-corrosive residue Non-conductive residue
Datasheet

Suppliers

Company
Product
Description
Supplier Links
MG Chemicals 4884 Solder Wire Silver 0.025
Bidford on Avon, United Kingdom
MG Chemicals 4884 Solder Wire Silver 0.025" Dia.
MGEN00012
MG Chemicals 4884 Solder Wire Silver 0.025" Dia. MGEN00012
MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp melting/solidificati on point, which results in robust and reliable joints that are highly resistant to whisker formation. MG 4884 is fast wetting, fast flowing, non-corrosive and non-conductive. Please note this grade is REACH compliant however not RoHS compliant due to lead content. Product Benefits Eutectic alloy (liquidus = solidus temperature) Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements Flux meets J-STD-004B Rosin-activated flux Fast wetting Fast flowing Non-corrosive residue Non-conductive residue

MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.

MG 4884 is fast wetting, fast flowing, non-corrosive and non-conductive. Please note this grade is REACH compliant however not RoHS compliant due to lead content.

Product Benefits

  • Eutectic alloy (liquidus = solidus temperature)
  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Rosin-activated flux
  • Fast wetting
  • Fast flowing
  • Non-corrosive residue
  • Non-conductive residue
Supplier's Site Datasheet

Technical Specifications

  Techsil Limited
Product Category Filler Alloys and Consumables
Product Number MGEN00012
Product Name MG Chemicals 4884 Solder Wire Silver 0.025" Dia.
Joining Process / Product Form Solid wire or rod; Flux Cored Wire
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