A sulfate based chemistry that utilizes a proprietary palladium complex to create a precision catalyst for selective plating of electroless nickel on copper traces and pads. The palladium complex controls the exchange reaction of Pd for Cu during catalyzation and improves the stability of palladium in the solution. When compared to current palladium activators, TechniCatalyst AT4608 provides a wider process window for fine spaces, eliminates deposition on porous materials like Teflon or polyimide, and reduces cost through longer bath life and lower palladium consumption.
| Technic, Inc. | |
|---|---|
| Product Category | Chemical Additives and Agents |
| Product Number | TechniCatalyst AT4608 |
| Product Name | Catalyst |
| Function | Catalyst |
