Technic, Inc. Advanced Vertical Plating for Thin Substrates Technic MP200

The Technic MP200 is an advanced VCP design for plating of thin substrates in panel, cut sheet or roll. The equipment can be adapted to seed layer plating as well as panel or pattern plating of copper, tin, nickel and or gold. The Technic MP200 perfects the VCP concept and provides: Effective handling of thin substrates World class distribution and throwing power Low maintenance time and cost A perfect plated surface Reduced water usage