Technic, Inc. Advanced Vertical Plating for Thin Substrates Technic MP200

Description
The Technic MP200 is an advanced VCP design for plating of thin substrates in panel, cut sheet or roll. The equipment can be adapted to seed layer plating as well as panel or pattern plating of copper, tin, nickel and or gold. The Technic MP200 perfects the VCP concept and provides: Effective handling of thin substrates World class distribution and throwing power Low maintenance time and cost A perfect plated surface Reduced water usage
  • Advanced Vertical Plating for Thin Substrates - Technic MP200 - Technic, Inc.
    Technic, Inc.
Description
The Technic MP200 is an advanced VCP design for plating of thin substrates in panel, cut sheet or roll. The equipment can be adapted to seed layer plating as well as panel or pattern plating of copper, tin, nickel and or gold. The Technic MP200 perfects the VCP concept and provides: Effective handling of thin substrates World class distribution and throwing power Low maintenance time and cost A perfect plated surface Reduced water usage

Suppliers

Company
Product
Description
Supplier Links
Advanced Vertical Plating for Thin Substrates - Technic MP200 - Technic, Inc.
Technic, Inc.
Cranston, RI, USA
Advanced Vertical Plating for Thin Substrates
Technic MP200
Advanced Vertical Plating for Thin Substrates Technic MP200
The Technic MP200 is an advanced VCP design for plating of thin substrates in panel, cut sheet or roll. The equipment can be adapted to seed layer plating as well as panel or pattern plating of copper, tin, nickel and or gold. The Technic MP200 perfects the VCP concept and provides: Effective handling of thin substrates World class distribution and throwing power Low maintenance time and cost A perfect plated surface Reduced water usage

The Technic MP200 is an advanced VCP design for plating of thin substrates in panel, cut sheet or roll. The equipment can be adapted to seed layer plating as well as panel or pattern plating of copper, tin, nickel and or gold. The Technic MP200 perfects the VCP concept and provides:

  • Effective handling of thin substrates
  • World class distribution and throwing power
  • Low maintenance time and cost
  • A perfect plated surface
  • Reduced water usage
Supplier's Site

Technical Specifications

  Technic, Inc.
Product Category Plating and Anodizing Equipment
Product Number Technic MP200
Product Name Advanced Vertical Plating for Thin Substrates
Process / Technology Electroplating
Unlock Full Specs
to access all available technical data

Similar Products

Arc Filament type Ion Plating equipment (AF-IP equipment) SHINKO SEIKI - - Daitron Co., Ltd.
Daitron Co., Ltd.
Arc Filament type Ion Plating equipment (AF-IP equipment) SHINKO SEIKI
Specs
Process / Technology Ion Plating
Application / Industry Semiconductor / Wafer; Precision metal mold or parts of semiconductor manufacturing equipment
View Details
Benchtop Electroplating Machines - IKo Twin-Station - ECSI Fibrotools
ECSI Fibrotools
Benchtop Electroplating Machines
IKo Twin-Station
Specs
Process / Technology Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
Application / Industry Medical Devices; Semiconductor / Wafer
Machinery Type Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
View Details
Acid Purification for Aluminum Anodizing AnoPur™ - - Eco-Tec, Inc.
Eco-Tec, Inc.
Acid Purification for Aluminum Anodizing AnoPur™
Specs
Process / Technology Anodizing
View Details
Plating Equipment - - Metalor Technologies USA Corporation
Metalor Technologies USA Corporation
Plating Equipment
Specs
Process / Technology Electroplating; Electroless
Application / Industry Electrical / Electronic Parts (Connectors, Pins, etc.); Semiconductor / Wafer; Tab / Finger Plating
Machinery Type Barrel, tumbler or tumble belt; Batch - Vibratory / Ultrasonic; Continuous (Web, Reel , Roll); Rack / Hook
View Details