TE Connectivity Wire-to-Board Headers & Receptacles YD3JFF35PN2BTG0000

Configuration Features Number of Positions : 66 PCB Mount Orientation : Vertical Contact Features Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Finish : Bright Contact Mating Area Plating Material Thickness (MICIN) : .00005 Contact Type : Pin Housing Features Centerline (Pitch) : .25 MM  [.01 INCH ] Housing Material : Aluminum Mechanical Attachment Connector Mounting Type : Bulkhead Mating Retention : Without PCB Mount Alignment : Without PCB Mount Retention : Without Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Bag Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Board Header Type : Standard PCB Connector Assembly Type : PCB Mount Receptacle Sealable : Yes Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Usage Conditions Operating Temperature Range : -65 - 200 DEGC  [-85 - 392 DEGF ]