TE Connectivity DIMM Sockets 9-2199154-8

Description
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Material : High Temperature Thermoplastic Ejector Material Color : Blue (2935U) Ejector Type : Standard Latch Color : Black Latch Material : High Temperature Thermoplastic Module Key Type : Offset Right PCB Retention Feature Material : Stainless Steel Retention Post Location : None Configuration Features Module Orientation : Vertical Number of Bays : 2 Number of Keys : 1 Number of Positions : 288 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .75 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .38 MICM  [15 MICIN ] Contact Underplating Material : Nickel Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 3 MICM  [118.1 MICIN ] Socket Style : DIMM Dimensions Center Retention Hole Diameter : 1.2 MM  [.047 INCH ] Profile Height from PCB : 20 MM  [.787 INCH ] Row-to-Row Spacing : 2.2 MM  [.08 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.2 Housing Features Centerline (Pitch) : .85 MM  [.033 INCH ] Housing Color : Blue Housing Material : High Temperature Nylon Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Offset Right Mount Angle : Vertical PCB Mount Retention : With PCB Mount Retention Type : Boardlock Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray, Box & Tray Packaging Quantity : 80 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 4 Termination Features Insertion Style : Direct Insert Termination Method to PCB : Through Hole - Solder Termination Post & Tail Length : 2.1 MM  [.083 INCH ] Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
  • DIMM Sockets - 9-2199154-8 - TE Connectivity
    TE Connectivity
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Description
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Material : High Temperature Thermoplastic Ejector Material Color : Blue (2935U) Ejector Type : Standard Latch Color : Black Latch Material : High Temperature Thermoplastic Module Key Type : Offset Right PCB Retention Feature Material : Stainless Steel Retention Post Location : None Configuration Features Module Orientation : Vertical Number of Bays : 2 Number of Keys : 1 Number of Positions : 288 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .75 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .38 MICM  [15 MICIN ] Contact Underplating Material : Nickel Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 3 MICM  [118.1 MICIN ] Socket Style : DIMM Dimensions Center Retention Hole Diameter : 1.2 MM  [.047 INCH ] Profile Height from PCB : 20 MM  [.787 INCH ] Row-to-Row Spacing : 2.2 MM  [.08 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.2 Housing Features Centerline (Pitch) : .85 MM  [.033 INCH ] Housing Color : Blue Housing Material : High Temperature Nylon Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Offset Right Mount Angle : Vertical PCB Mount Retention : With PCB Mount Retention Type : Boardlock Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray, Box & Tray Packaging Quantity : 80 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 4 Termination Features Insertion Style : Direct Insert Termination Method to PCB : Through Hole - Solder Termination Post & Tail Length : 2.1 MM  [.083 INCH ] Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
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Suppliers

Company
Product
Description
Supplier Links
DIMM Sockets - 9-2199154-8 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
DIMM Sockets
9-2199154-8
DIMM Sockets 9-2199154-8
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Material : High Temperature Thermoplastic Ejector Material Color : Blue (2935U) Ejector Type : Standard Latch Color : Black Latch Material : High Temperature Thermoplastic Module Key Type : Offset Right PCB Retention Feature Material : Stainless Steel Retention Post Location : None Configuration Features Module Orientation : Vertical Number of Bays : 2 Number of Keys : 1 Number of Positions : 288 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .75 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .38 MICM  [15 MICIN ] Contact Underplating Material : Nickel Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 3 MICM  [118.1 MICIN ] Socket Style : DIMM Dimensions Center Retention Hole Diameter : 1.2 MM  [.047 INCH ] Profile Height from PCB : 20 MM  [.787 INCH ] Row-to-Row Spacing : 2.2 MM  [.08 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.2 Housing Features Centerline (Pitch) : .85 MM  [.033 INCH ] Housing Color : Blue Housing Material : High Temperature Nylon Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Offset Right Mount Angle : Vertical PCB Mount Retention : With PCB Mount Retention Type : Boardlock Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray, Box & Tray Packaging Quantity : 80 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 4 Termination Features Insertion Style : Direct Insert Termination Method to PCB : Through Hole - Solder Termination Post & Tail Length : 2.1 MM  [.083 INCH ] Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]

Body Features


  • Connector Profile : Standard
  • Ejector Location : Both Ends
  • Ejector Material : High Temperature Thermoplastic
  • Ejector Material Color : Blue (2935U)
  • Ejector Type : Standard
  • Latch Color : Black
  • Latch Material : High Temperature Thermoplastic
  • Module Key Type : Offset Right
  • PCB Retention Feature Material : Stainless Steel
  • Retention Post Location : None

Configuration Features


  • Module Orientation : Vertical
  • Number of Bays : 2
  • Number of Keys : 1
  • Number of Positions : 288
  • Number of Rows : 2

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : .75
  • Contact Mating Area Plating Material : Gold
  • Contact Mating Area Plating Material Thickness : .38 MICM  [15 MICIN ]
  • Contact Underplating Material : Nickel
  • Memory Socket Type : Memory Card
  • PCB Contact Termination Area Plating Material : Tin
  • PCB Contact Termination Area Plating Material Thickness : 3 MICM  [118.1 MICIN ]
  • Socket Style : DIMM

Dimensions


  • Center Retention Hole Diameter : 1.2 MM  [.047 INCH ]
  • Profile Height from PCB : 20 MM  [.787 INCH ]
  • Row-to-Row Spacing : 2.2 MM  [.08 INCH ]

Electrical Characteristics


  • DRAM Voltage (V) : 1.2

Housing Features


  • Centerline (Pitch) : .85 MM  [.033 INCH ]
  • Housing Color : Blue
  • Housing Material : High Temperature Nylon

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment : With
  • Mating Alignment Type : Offset Right
  • Mount Angle : Vertical
  • PCB Mount Retention : With
  • PCB Mount Retention Type : Boardlock

Operation/Application


  • Circuit Application : Signal

Packaging Features


  • Packaging Method : Tray, Box & Tray
  • Packaging Quantity : 80

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Board
  • DRAM Type : Double Data Rate (DDR) 4

Termination Features


  • Insertion Style : Direct Insert
  • Termination Method to PCB : Through Hole - Solder
  • Termination Post & Tail Length : 2.1 MM  [.083 INCH ]

Usage Conditions


  • Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
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Technical Specifications

  TE Connectivity
Product Category IC Interconnect Components
Product Number 9-2199154-8
Product Name DIMM Sockets
Product Type IC Socket
Socket Type DIMM
Mounting Through-Hole; Board Mount
Voltage Rating 1.2 volts
Current Rating 0.7500 amps
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