Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Tin Contact Mating Area Plating Material Thickness : .76 MICM [29.9212 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Pre-Tin PCB Contact Termination Area Plating Material Thickness : .76 MICM [29.9212 MICIN ]
Dimensions PCB Thickness (Recommended) : 1.57 MM [.062 INCH ]
Housing Features Mating Entry Location : Bottom
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 5000
Product Type Features Applied Pressure : High
Termination Features Product Terminates To : Printed Circuit Board Termination Post & Tail Length : 2.85 MM [.112 INCH ]
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
TE Connectivity
Done
Request a Quote
Email Supplier
Description
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Tin Contact Mating Area Plating Material Thickness : .76 MICM [29.9212 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Pre-Tin PCB Contact Termination Area Plating Material Thickness : .76 MICM [29.9212 MICIN ]
Dimensions PCB Thickness (Recommended) : 1.57 MM [.062 INCH ]
Housing Features Mating Entry Location : Bottom
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 5000
Product Type Features Applied Pressure : High
Termination Features Product Terminates To : Printed Circuit Board Termination Post & Tail Length : 2.85 MM [.112 INCH ]
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Tin Contact Mating Area Plating Material Thickness : .76 MICM [29.9212 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Pre-Tin PCB Contact Termination Area Plating Material Thickness : .76 MICM [29.9212 MICIN ]
Dimensions PCB Thickness (Recommended) : 1.57 MM [.062 INCH ]
Housing Features Mating Entry Location : Bottom
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 5000
Product Type Features Applied Pressure : High
Termination Features Product Terminates To : Printed Circuit Board Termination Post & Tail Length : 2.85 MM [.112 INCH ]
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Contact Features
Contact Base Material : Phosphor Bronze
Contact Current Rating (Max) (AMP) : 5
Contact Mating Area Plating Material : Tin
Contact Mating Area Plating Material Thickness : .76 MICM [29.9212 MICIN ]
Contact Orientation : Straight
Contact Type : Socket
PCB Contact Termination Area Plating Material : Pre-Tin
PCB Contact Termination Area Plating Material Thickness : .76 MICM [29.9212 MICIN ]
Dimensions
PCB Thickness (Recommended) : 1.57 MM [.062 INCH ]
Housing Features
Mating Entry Location : Bottom
Mechanical Attachment
PCB Mount Retention : Without
Wire Insulation Support : Without
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Reel
Packaging Quantity : 5000
Product Type Features
Applied Pressure : High
Termination Features
Product Terminates To : Printed Circuit Board
Termination Post & Tail Length : 2.85 MM [.112 INCH ]
Usage Conditions
Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
