Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Horizontal Contact Type : Socket PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .762 MICM [30 MICIN ]
Dimensions PCB Thickness (Recommended) : 1.57 MM [.062 INCH ]
Housing Features Mating Entry Location : Side
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 20000
Product Type Features Applied Pressure : Standard
Termination Features Product Terminates To : Printed Circuit Board
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
TE Connectivity
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Description
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Horizontal Contact Type : Socket PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .762 MICM [30 MICIN ]
Dimensions PCB Thickness (Recommended) : 1.57 MM [.062 INCH ]
Housing Features Mating Entry Location : Side
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 20000
Product Type Features Applied Pressure : Standard
Termination Features Product Terminates To : Printed Circuit Board
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Horizontal Contact Type : Socket PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .762 MICM [30 MICIN ]
Dimensions PCB Thickness (Recommended) : 1.57 MM [.062 INCH ]
Housing Features Mating Entry Location : Side
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 20000
Product Type Features Applied Pressure : Standard
Termination Features Product Terminates To : Printed Circuit Board
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Contact Features
Contact Base Material : Phosphor Bronze
Contact Current Rating (Max) (AMP) : 3
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ]
Contact Orientation : Horizontal
Contact Type : Socket
PCB Contact Termination Area Plating Material : Gold
PCB Contact Termination Area Plating Material Thickness : .762 MICM [30 MICIN ]
Dimensions
PCB Thickness (Recommended) : 1.57 MM [.062 INCH ]
Housing Features
Mating Entry Location : Side
Mechanical Attachment
PCB Mount Retention : Without
Wire Insulation Support : Without
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Reel
Packaging Quantity : 20000
Product Type Features
Applied Pressure : Standard
Termination Features
Product Terminates To : Printed Circuit Board
Usage Conditions
Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
