TE Connectivity IC Sockets 818-AG11D-ES

Description
"18 (2 x 9) Pos DIP, 0.3"" (7.62mm) Row Spacing Socket Gold Through Hole"
Request a Quote Datasheet
Description
"18 (2 x 9) Pos DIP, 0.3"" (7.62mm) Row Spacing Socket Gold Through Hole"
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
IC Sockets - A113642-ND - DigiKey
Thief River Falls, MN, United States
IC Sockets
A113642-ND
IC Sockets A113642-ND
"18 (2 x 9) Pos DIP, 0.3"" (7.62mm) Row Spacing Socket Gold Through Hole"

"18 (2 x 9) Pos DIP, 0.3"" (7.62mm) Row Spacing Socket Gold Through Hole"

Buy Now Datasheet
Sockets for ICs, Transistors - 818-AG11D-ES - Lingto Electronic Limited
Shenzhen, China
Sockets for ICs, Transistors
818-AG11D-ES
Sockets for ICs, Transistors 818-AG11D-ES
CONN IC DIP SOCKET 18POS GOLD

CONN IC DIP SOCKET 18POS GOLD

Supplier's Site Datasheet
Dip Socket, 18 Position, Through Hole; No. Of Contacts Amp - Te Connectivity - 97F7801 - Newark, An Avnet Company
Chicago, IL, United States
Dip Socket, 18 Position, Through Hole; No. Of Contacts Amp - Te Connectivity
97F7801
Dip Socket, 18 Position, Through Hole; No. Of Contacts Amp - Te Connectivity 97F7801
DIP SOCKET, 18 POSITION, THROUGH HOLE; No. of Contacts:18Contacts; Connector Type:DIP Socket; Pitch Spacing:2.54mm; Product Range:800 Series; Row Pitch:7.62mm; Contact Material:Beryllium Copper; Contact Plating:Gold Plated Contacts RoHS Compliant: No

DIP SOCKET, 18 POSITION, THROUGH HOLE; No. of Contacts:18Contacts; Connector Type:DIP Socket; Pitch Spacing:2.54mm; Product Range:800 Series; Row Pitch:7.62mm; Contact Material:Beryllium Copper; Contact Plating:Gold Plated Contacts RoHS Compliant: No

Supplier's Site

Technical Specifications

  DigiKey Lingto Electronic Limited Newark, An Avnet Company
Product Category Board Mount Connectors Electrical Connectors Electrical Connectors
Product Number A113642-ND 818-AG11D-ES 97F7801
Product Name IC Sockets Sockets for ICs, Transistors Dip Socket, 18 Position, Through Hole; No. Of Contacts Amp - Te Connectivity
Mounting Through Hole
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