Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Tin (Sn) Contact Mating Area Plating Material Thickness : 2.54 - 3.81 MICM [100 - 150 MICIN ] Contact Orientation : Straight Contact Type : Pin Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 50000
Termination Features Product Terminates To : Printed Circuit Board
Usage Conditions Operating Temperature Range : -65 - 100 DEGC [-85 - 212 DEGF ]
TE Connectivity
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Description
Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Tin (Sn) Contact Mating Area Plating Material Thickness : 2.54 - 3.81 MICM [100 - 150 MICIN ] Contact Orientation : Straight Contact Type : Pin Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 50000
Termination Features Product Terminates To : Printed Circuit Board
Usage Conditions Operating Temperature Range : -65 - 100 DEGC [-85 - 212 DEGF ]
Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Tin (Sn) Contact Mating Area Plating Material Thickness : 2.54 - 3.81 MICM [100 - 150 MICIN ] Contact Orientation : Straight Contact Type : Pin Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 50000
Termination Features Product Terminates To : Printed Circuit Board
Usage Conditions Operating Temperature Range : -65 - 100 DEGC [-85 - 212 DEGF ]
Contact Features
Contact Base Material : Brass
Contact Current Rating (Max) (AMP) : 3
Contact Mating Area Plating Material : Tin (Sn)
Contact Mating Area Plating Material Thickness : 2.54 - 3.81 MICM [100 - 150 MICIN ]
Contact Orientation : Straight
Contact Type : Pin
Contact Underplating Material : Nickel
PCB Contact Termination Area Plating Material : Tin
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Reel
Packaging Quantity : 50000
Termination Features
Product Terminates To : Printed Circuit Board
Usage Conditions
Operating Temperature Range : -65 - 100 DEGC [-85 - 212 DEGF ]
