Body Features PCB Retention Feature Material : Copper Alloy Primary Product Color : Black
Configuration Features Board-to-Board Configuration : Parallel Connector Contact Load Condition : Fully Loaded Number of Positions : 100 Number of Rows : 2 PCB Mount Orientation : Vertical
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 3.6 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .03 MICM [1.18 MICIN ] Contact Shape & Form : Dual Beam Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin-Lead PCB Contact Termination Area Plating Material Finish : Matte PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ]
Dimensions PCB Thickness (Recommended) : 1.57 MM [.062 INCH ] Row-to-Row Spacing : 2.54 MM [.1 INCH ]
Electrical Characteristics Dielectric Withstanding Voltage (Max) (VAC) : 500 Insulation Resistance (MEGO) : 5000 Operating Voltage (VAC) : 30
Housing Features Centerline (Pitch) : 1.27 MM [.05 INCH ] Housing Material : LCP
Industry Standards Compatible With Agency/Standards Products : CSA, UL Compatible With Approved Standards Products : UL E28476, CSA LR7189 UL Flammability Rating : UL 94V-0 UL Rating : Recognized
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without PCB Mount Alignment : Without PCB Mount Retention : With PCB Mount Retention Type : Hold-Down
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Box, Tube
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector Product Type : Connector Assembly Connector System : Board-to-Board PCB Connector Type : PCB Mount Receptacle Sealable : No
Termination Features Termination Method to PCB : Surface Mount
Usage Conditions Housing Temperature Rating : High Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Body Features
- PCB Retention Feature Material : Copper Alloy
- Primary Product Color : Black
Configuration Features
- Board-to-Board Configuration : Parallel
- Connector Contact Load Condition : Fully Loaded
- Number of Positions : 100
- Number of Rows : 2
- PCB Mount Orientation : Vertical
Contact Features
- Contact Base Material : Copper Alloy
- Contact Current Rating (Max) (AMP) : 3.6
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Thickness : .03 MICM [1.18 MICIN ]
- Contact Shape & Form : Dual Beam
- Contact Type : Socket
- Contact Underplating Material : Nickel
- PCB Contact Termination Area Plating Material : Tin-Lead
- PCB Contact Termination Area Plating Material Finish : Matte
- PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ]
Dimensions
- PCB Thickness (Recommended) : 1.57 MM [.062 INCH ]
- Row-to-Row Spacing : 2.54 MM [.1 INCH ]
Electrical Characteristics
- Dielectric Withstanding Voltage (Max) (VAC) : 500
- Insulation Resistance (MEGO) : 5000
- Operating Voltage (VAC) : 30
Housing Features
- Centerline (Pitch) : 1.27 MM [.05 INCH ]
- Housing Material : LCP
Industry Standards
- Compatible With Agency/Standards Products : CSA, UL
- Compatible With Approved Standards Products : UL E28476, CSA LR7189
- UL Flammability Rating : UL 94V-0
- UL Rating : Recognized
Mechanical Attachment
- Connector Mounting Type : Board Mount
- Mating Alignment : Without
- PCB Mount Alignment : Without
- PCB Mount Retention : With
- PCB Mount Retention Type : Hold-Down
Operation/Application
- Circuit Application : Signal
Packaging Features
- Packaging Method : Box, Tube
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector Product Type : Connector Assembly
- Connector System : Board-to-Board
- PCB Connector Type : PCB Mount Receptacle
- Sealable : No
Termination Features
- Termination Method to PCB : Surface Mount
Usage Conditions
- Housing Temperature Rating : High
- Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
