TE Connectivity
Connector Contacts
66570-2
Description
Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 3.1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Size : Size 20 Contact Type : Pin Contact Underplating Material : Nickel Mating Pin Diameter : 1.02 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Gold Flash
Dimensions Wire Size (MMSQ) : .8 - .9 Wire Size (AWG) : 18
Mechanical Attachment Contact Retention Type Within Housing : Snap-In Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Strip Packaging Quantity : 10000
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Solder Termination Post & Tail Diameter (INCH) : .085 Termination Post & Tail Length (INCH) : .39
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
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Description
Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 3.1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Size : Size 20 Contact Type : Pin Contact Underplating Material : Nickel Mating Pin Diameter : 1.02 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Gold Flash
Dimensions Wire Size (MMSQ) : .8 - .9 Wire Size (AWG) : 18
Mechanical Attachment Contact Retention Type Within Housing : Snap-In Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Strip Packaging Quantity : 10000
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Solder Termination Post & Tail Diameter (INCH) : .085 Termination Post & Tail Length (INCH) : .39
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Request a Quote
Email Supplier
Suppliers
Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 3.1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Size : Size 20 Contact Type : Pin Contact Underplating Material : Nickel Mating Pin Diameter : 1.02 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Gold Flash
Dimensions Wire Size (MMSQ) : .8 - .9 Wire Size (AWG) : 18
Mechanical Attachment Contact Retention Type Within Housing : Snap-In Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Strip Packaging Quantity : 10000
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Solder Termination Post & Tail Diameter (INCH) : .085 Termination Post & Tail Length (INCH) : .39
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features
- Contact Base Material : Brass
- Contact Current Rating (Max) (AMP) : 3.1
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Thickness (MICIN) : 30
- Contact Size : Size 20
- Contact Type : Pin
- Contact Underplating Material : Nickel
- Mating Pin Diameter : 1.02 MM [.04 INCH ]
- PCB Contact Termination Area Plating Material : Gold Flash
Dimensions
- Wire Size (MMSQ) : .8 - .9
- Wire Size (AWG) : 18
Mechanical Attachment
- Contact Retention Type Within Housing : Snap-In
- Wire Insulation Support : Without
Operation/Application
- Circuit Application : Signal
Packaging Features
- Packaging Method : Strip
- Packaging Quantity : 10000
Termination Features
- Product Terminates To : Wire & Cable
- Termination Method to Wire & Cable : Solder
- Termination Post & Tail Diameter (INCH) : .085
- Termination Post & Tail Length (INCH) : .39
Usage Conditions
- Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
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Technical Specifications
|
Product Category
|
Wire Terminals |
|
Product Number
|
66570-2 |
|
Product Name
|
Connector Contacts |
|
Features
|
RoHS
|
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