Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 200 Contact Mating Area Plating Material : Gold Flash Contact Mating Area Plating Material Thickness : .254 MICM [10 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : With Contact Size : Size 0 Contact Type : Socket Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.06 MICM [40 MICIN ] Mating Pin Diameter : 9.06 MM [.357 INCH ]
Electrical Characteristics Operating Voltage (VAC) : 250 Operating Voltage (VDC) : 250
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Package Packaging Quantity : 100
Product Type Features Sealable : No
Termination Features Product Terminates To : Busbar
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Contact Features
- Contact Base Material : Copper Alloy
- Contact Current Rating (Max) (AMP) : 200
- Contact Mating Area Plating Material : Gold Flash
- Contact Mating Area Plating Material Thickness : .254 MICM [10 MICIN ]
- Contact Orientation : Straight
- Contact Retention Within Housing : With
- Contact Size : Size 0
- Contact Type : Socket
- Contact Underplating Material : Nickel
- Contact Underplating Material Thickness : 1.06 MICM [40 MICIN ]
- Mating Pin Diameter : 9.06 MM [.357 INCH ]
Electrical Characteristics
- Operating Voltage (VAC) : 250
- Operating Voltage (VDC) : 250
Mechanical Attachment
- Wire Insulation Support : Without
Operation/Application
- Circuit Application : Power
Packaging Features
- Packaging Method : Package
- Packaging Quantity : 100
Product Type Features
Termination Features
- Product Terminates To : Busbar
Usage Conditions
- Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
