TE Connectivity Connector Contacts 6648374-1

Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 35 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM  [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : Size 12 Contact Type : Socket Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1 MICM  [40 MICIN ] Mating Pin Diameter : 2.28 MM  [.09 INCH ] PCB Contact Termination Area Plating Material : Silver PCB Contact Termination Area Plating Material Thickness : 5.08 - 7.62 MICM  [200 - 300 MICIN ] Wire Contact Termination Area Plating Material Finish : Bright Mechanical Attachment Wire Insulation Support : Without Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Bag Packaging Quantity : 500 Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]