Configuration Features Board-to-Board Configuration : Right Angle Mating & Unmating Configuration : Sequencing Number of Positions : 14 Number of Power Positions : 2 Number of Rows : 4 Number of Signal Positions : 12 PCB Mount Orientation : Right Angle
Contact Features Contact Current Rating (Max) (AMP) : 50 Contact Mating Area Plating Material : Noble Metal Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Retention Within Housing : Without Contact Type : Pin PCB Contact Termination Area Plating Material : Tin Power Contact Base Material : Tin Underplate Material Thickness (MICM) : 3.05
Dimensions Row-to-Row Spacing : 2.45 MM [.1 INCH ]
Electrical Characteristics Operating Voltage (VAC) : 300, 60 Operating Voltage (VDC) : 60, 300
Housing Features Centerline (Pitch) : 2.54 MM , 7.62 MM [.3 INCH , .1 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic
Industry Standards Glow Wire Rating : High Temperature Part - Not Glow Wire UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Retention Type : Boardlock PCB Mount Retention : With PCB Mount Retention Type : Boardlock
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Tray
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector & Housing Type : Plug Connector System : Board-to-Board Rectangular Power Connector Type : Header Sealable : No
Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit Termination Post & Tail Length : 3.05 MM [.12 INCH ]
Usage Conditions Operating Temperature Range : -40 - 125 DEGC [-40 - 257 DEGF ]
Configuration Features
- Board-to-Board Configuration : Right Angle
- Mating & Unmating Configuration : Sequencing
- Number of Positions : 14
- Number of Power Positions : 2
- Number of Rows : 4
- Number of Signal Positions : 12
- PCB Mount Orientation : Right Angle
Contact Features
- Contact Current Rating (Max) (AMP) : 50
- Contact Mating Area Plating Material : Noble Metal
- Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
- Contact Retention Within Housing : Without
- Contact Type : Pin
- PCB Contact Termination Area Plating Material : Tin
- Power Contact Base Material : Tin
- Underplate Material Thickness (MICM) : 3.05
Dimensions
- Row-to-Row Spacing : 2.45 MM [.1 INCH ]
Electrical Characteristics
- Operating Voltage (VAC) : 300, 60
- Operating Voltage (VDC) : 60, 300
Housing Features
- Centerline (Pitch) : 2.54 MM , 7.62 MM [.3 INCH , .1 INCH ]
- Housing Color : Black
- Housing Material : High Temperature Thermoplastic
Industry Standards
- Glow Wire Rating : High Temperature Part - Not Glow Wire
- UL Flammability Rating : UL 94V-0
Mechanical Attachment
- Connector Mounting Type : Board Mount
- Mating Retention Type : Boardlock
- PCB Mount Retention : With
- PCB Mount Retention Type : Boardlock
Operation/Application
- Circuit Application : Power & Signal
Packaging Features
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector & Housing Type : Plug
- Connector System : Board-to-Board
- Rectangular Power Connector Type : Header
- Sealable : No
Termination Features
- Termination Method to Printed Circuit Board : Through Hole - Press-Fit
- Termination Post & Tail Length : 3.05 MM [.12 INCH ]
Usage Conditions
- Operating Temperature Range : -40 - 125 DEGC [-40 - 257 DEGF ]