Configuration Features Board-to-Board Configuration : Vertical Mating & Unmating Configuration : Sequencing Number of Positions : 25 Number of Power Positions : 1 Number of Rows : 4 Number of Signal Positions : 24 PCB Mount Orientation : Vertical
Contact Features Contact Current Rating (Max) (AMP) : 42 Contact Mating Area Plating Material : Noble Metal Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Retention Within Housing : Without Contact Type : Socket PCB Contact Termination Area Plating Material : Tin Power Contact Base Material : Tin Underplate Material Thickness (MICM) : 3.43
Dimensions Row-to-Row Spacing : 2.54 MM [.1 INCH ]
Electrical Characteristics Operating Voltage (VAC) : 60 Operating Voltage (VDC) : 60
Housing Features Centerline (Pitch) : 2.54 MM [.1 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic
Industry Standards Glow Wire Rating : High Temperature Part - Not Glow Wire UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Retention Type : Boardlock PCB Mount Retention : With PCB Mount Retention Type : Boardlock
Operation/Applicatio
n Circuit Application : Power & Signal
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector & Housing Type : Receptacle Connector System : Board-to-Board Rectangular Power Connector Type : Header Sealable : No
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Termination Post & Tail Length : 3.43 MM [.135 INCH ]
Usage Conditions Operating Temperature Range : -20 - 105 DEGC [-4 - 221 DEGF ]
Configuration Features
- Board-to-Board Configuration : Vertical
- Mating & Unmating Configuration : Sequencing
- Number of Positions : 25
- Number of Power Positions : 1
- Number of Rows : 4
- Number of Signal Positions : 24
- PCB Mount Orientation : Vertical
Contact Features
- Contact Current Rating (Max) (AMP) : 42
- Contact Mating Area Plating Material : Noble Metal
- Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
- Contact Retention Within Housing : Without
- Contact Type : Socket
- PCB Contact Termination Area Plating Material : Tin
- Power Contact Base Material : Tin
- Underplate Material Thickness (MICM) : 3.43
Dimensions
- Row-to-Row Spacing : 2.54 MM [.1 INCH ]
Electrical Characteristics
- Operating Voltage (VAC) : 60
- Operating Voltage (VDC) : 60
Housing Features
- Centerline (Pitch) : 2.54 MM [.1 INCH ]
- Housing Color : Black
- Housing Material : High Temperature Thermoplastic
Industry Standards
- Glow Wire Rating : High Temperature Part - Not Glow Wire
- UL Flammability Rating : UL 94V-0
Mechanical Attachment
- Connector Mounting Type : Board Mount
- Mating Retention Type : Boardlock
- PCB Mount Retention : With
- PCB Mount Retention Type : Boardlock
Operation/Application
- Circuit Application : Power & Signal
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector & Housing Type : Receptacle
- Connector System : Board-to-Board
- Rectangular Power Connector Type : Header
- Sealable : No
Termination Features
- Termination Method to Printed Circuit Board : Through Hole - Solder
- Termination Post & Tail Length : 3.43 MM [.135 INCH ]
Usage Conditions
- Operating Temperature Range : -20 - 105 DEGC [-4 - 221 DEGF ]
