Configuration Features Connection Capacity : Single
Contact Features Contact Mating Area Plating Material Thickness : 3.81 MICM [150 MICIN ] Contact Underplating Material : Copper, Nickel Contact Underplating Material Thickness : 1.27 MICM , 2.54 MICM [100 MICIN , 50 MICIN ] Mating Tab Thickness : .8 MM [.031 INCH ] Mating Tab Width : 4.75 MM [.187 INCH ] PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin
Dimensions Extension Below Board : 3.81 MM [150 INCH ] PCB Hole Diameter : 1.4 MM [.055 INCH ] PCB Thickness (Recommended) : 1.57 MM [.062 INCH ] Profile Height from PCB : 8.64 MM [.344 INCH ] Terminal Material Thickness : .8 MM [.031 INCH ]
Mechanical Attachment Wire Insulation Support : Without
Packaging Features Packaging Method : Loose Piece
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -40 - 110 DEGC [-40 - 230 DEGF ]
TE Connectivity
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Description
Configuration Features Connection Capacity : Single
Contact Features Contact Mating Area Plating Material Thickness : 3.81 MICM [150 MICIN ] Contact Underplating Material : Copper, Nickel Contact Underplating Material Thickness : 1.27 MICM , 2.54 MICM [100 MICIN , 50 MICIN ] Mating Tab Thickness : .8 MM [.031 INCH ] Mating Tab Width : 4.75 MM [.187 INCH ] PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin
Dimensions Extension Below Board : 3.81 MM [150 INCH ] PCB Hole Diameter : 1.4 MM [.055 INCH ] PCB Thickness (Recommended) : 1.57 MM [.062 INCH ] Profile Height from PCB : 8.64 MM [.344 INCH ] Terminal Material Thickness : .8 MM [.031 INCH ]
Mechanical Attachment Wire Insulation Support : Without
Packaging Features Packaging Method : Loose Piece
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -40 - 110 DEGC [-40 - 230 DEGF ]
Configuration Features Connection Capacity : Single
Contact Features Contact Mating Area Plating Material Thickness : 3.81 MICM [150 MICIN ] Contact Underplating Material : Copper, Nickel Contact Underplating Material Thickness : 1.27 MICM , 2.54 MICM [100 MICIN , 50 MICIN ] Mating Tab Thickness : .8 MM [.031 INCH ] Mating Tab Width : 4.75 MM [.187 INCH ] PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin
Dimensions Extension Below Board : 3.81 MM [150 INCH ] PCB Hole Diameter : 1.4 MM [.055 INCH ] PCB Thickness (Recommended) : 1.57 MM [.062 INCH ] Profile Height from PCB : 8.64 MM [.344 INCH ] Terminal Material Thickness : .8 MM [.031 INCH ]
Mechanical Attachment Wire Insulation Support : Without
Packaging Features Packaging Method : Loose Piece
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -40 - 110 DEGC [-40 - 230 DEGF ]
Configuration Features
Connection Capacity : Single
Contact Features
Contact Mating Area Plating Material Thickness : 3.81 MICM [150 MICIN ]
