TE Connectivity PCB Headers & Receptacles 6376609-1

Body Features

• Primary Product Color : Black

Configuration Features

• Board-to-Board Configuration : Parallel
• Number of Positions : 80
• PCB Mount Orientation : Vertical
• Stackable : Yes

Contact Features

• Contact Base Material : Copper Alloy
• Contact Current Rating (Max) (AMP) : .5
• Contact Mating Area Plating Material : Gold (Au)
• Contact Mating Area Plating Material Thickness (MICM) : .3
• Contact Type : Pin
• PCB Contact Termination Area Plating Material : Gold Flash
• PCB Contact Termination Area Plating Material Thickness : .3 MICM  [31.5 MICIN ]

Dimensions

• Connector Height : 20 MM  [.787 INCH ]
• PCB Thickness (Recommended) (MM) : 1.6
• Stack Height (MM) : 30

Electrical Characteristics

• Operating Voltage (VAC) : 10

Housing Features

• Centerline (Pitch) : .6 MM  [.023 INCH ]
• Housing Material : Liquid Crystal Polymer (LCP)
• Mating Entry Location : Top

Industry Standards

• UL Flammability Rating : UL 94V-0

Mechanical Attachment

• Connector Mounting Type : Board Mount
• Mating Alignment : With
• Mating Alignment Type : Chamfered Edges
• PCB Mount Alignment : With
• PCB Mount Alignment Type : Solder Peg
• PCB Mount Retention : With
• PCB Mount Retention Type : Solder Peg

Operation/Application

• Circuit Application : Signal

Packaging Features

• Packaging Method : Tray
• Packaging Quantity : 45

Product Type Features

• Connector & Contact Terminates To : Printed Circuit Board
• Connector Product Type : Connector Assembly
• Connector System : Board-to-Board
• Header Type : Partially Shrouded
• PCB Connector Type : PCB Mount Header
• Sealable : No

Termination Features

• Rectangular Termination Post & Tail Thickness : .25 MM  [.01 INCH ]
• Rectangular Termination Post & Tail Width : 1 MM  [.04 INCH ]
• Termination Method to PCB : Surface Mount

Usage Conditions

• Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]

MICRO STACK HDR ASSY 8OP H=20

Headers & Wire Housings