TE ConnectivityHard Metric Backplane Connectors636120-3
Description
Configuration Features Backplane Architecture : Mezzanine Number of Columns : 5 Number of Positions : 30 Number of Rows : 6 PCB Mount Orientation : Vertical
Contact Features CompactPCI Designation : None Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : .7 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .8 MICM [31.5 MICIN ] Contact Type : Pin Contact Underplating Material : Nickel Feedthrough Post Length (MM) : 3.7 PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions Backplane Module Length (MM) : 11.88
Housing Features Centerline (Pitch) : 2 MM [.078 INCH ] Housing Color : Black Housing Material : Polyester - GF
Industry Standards AdvancedTCA Specified Product : No
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Polarizing Peg
Operation/Applicatio
n Circuit Application : Signal Shielded : No
Packaging Features Packaging Method : Tube Packaging Quantity : 43
Product Type Features Backplane Interface Type : 2mm HM Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Header Sealable : No
Signal Characteristics Data Rate (GBS) : ≤1
Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
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Description
Configuration Features Backplane Architecture : Mezzanine Number of Columns : 5 Number of Positions : 30 Number of Rows : 6 PCB Mount Orientation : Vertical
Contact Features CompactPCI Designation : None Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : .7 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .8 MICM [31.5 MICIN ] Contact Type : Pin Contact Underplating Material : Nickel Feedthrough Post Length (MM) : 3.7 PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions Backplane Module Length (MM) : 11.88
Housing Features Centerline (Pitch) : 2 MM [.078 INCH ] Housing Color : Black Housing Material : Polyester - GF
Industry Standards AdvancedTCA Specified Product : No
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Polarizing Peg
Operation/Applicatio
n Circuit Application : Signal Shielded : No
Packaging Features Packaging Method : Tube Packaging Quantity : 43
Product Type Features Backplane Interface Type : 2mm HM Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Header Sealable : No
Signal Characteristics Data Rate (GBS) : ≤1
Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Configuration Features Backplane Architecture : Mezzanine Number of Columns : 5 Number of Positions : 30 Number of Rows : 6 PCB Mount Orientation : Vertical
Contact Features CompactPCI Designation : None Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : .7 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .8 MICM [31.5 MICIN ] Contact Type : Pin Contact Underplating Material : Nickel Feedthrough Post Length (MM) : 3.7 PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions Backplane Module Length (MM) : 11.88
Housing Features Centerline (Pitch) : 2 MM [.078 INCH ] Housing Color : Black Housing Material : Polyester - GF
Industry Standards AdvancedTCA Specified Product : No
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Polarizing Peg
Operation/Applicatio
n Circuit Application : Signal Shielded : No
Packaging Features Packaging Method : Tube Packaging Quantity : 43
Product Type Features Backplane Interface Type : 2mm HM Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Header Sealable : No
Signal Characteristics Data Rate (GBS) : ≤1
Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Configuration Features
Backplane Architecture : Mezzanine
Number of Columns : 5
Number of Positions : 30
Number of Rows : 6
PCB Mount Orientation : Vertical
Contact Features
CompactPCI Designation : None
Contact Base Material : Phosphor Bronze
Contact Current Rating (Max) (AMP) : .7
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : .8 MICM [31.5 MICIN ]
Contact Type : Pin
Contact Underplating Material : Nickel
Feedthrough Post Length (MM) : 3.7
PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions
Backplane Module Length (MM) : 11.88
Housing Features
Centerline (Pitch) : 2 MM [.078 INCH ]
Housing Color : Black
Housing Material : Polyester - GF
Industry Standards
AdvancedTCA Specified Product : No
Mechanical Attachment
Connector Mounting Type : Board Mount
Mating Alignment Type : Polarizing Peg
Operation/Application
Circuit Application : Signal
Shielded : No
Packaging Features
Packaging Method : Tube
Packaging Quantity : 43
Product Type Features
Backplane Interface Type : 2mm HM
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Board-to-Board
PCB Connector Assembly Type : PCB Mount Header
Sealable : No
Signal Characteristics
Data Rate (GBS) : ≤1
Termination Features
Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Usage Conditions
Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
