TE Connectivity
PCB Terminals
62262-1
Description
Contact Features Contact Mating Area Plating Material Thickness : 3.81 - 6.35 MICM [150 - 250 MICIN ] Contact Underplating Material : Copper Contact Underplating Material Thickness : 2.54 MICM [100 MICIN ] Mating Tab Thickness : .81 MM [.032 INCH ] Mating Tab Width : 6.35 MM [.25 INCH ] PCB Contact Termination Area Plating Material Thickness : 3.81 - 6.35 MICM [150 - 250 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin Terminal Size : 6.35
Dimensions PCB Thickness (Recommended) : 1.57 - 2.39 MM [.062 - .094 INCH ] Profile Height from PCB : 23.7 MM [.937 INCH ]
Packaging Features Packaging Method : Bag Packaging Quantity : 1000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
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Datasheet
Description
Contact Features Contact Mating Area Plating Material Thickness : 3.81 - 6.35 MICM [150 - 250 MICIN ] Contact Underplating Material : Copper Contact Underplating Material Thickness : 2.54 MICM [100 MICIN ] Mating Tab Thickness : .81 MM [.032 INCH ] Mating Tab Width : 6.35 MM [.25 INCH ] PCB Contact Termination Area Plating Material Thickness : 3.81 - 6.35 MICM [150 - 250 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin Terminal Size : 6.35
Dimensions PCB Thickness (Recommended) : 1.57 - 2.39 MM [.062 - .094 INCH ] Profile Height from PCB : 23.7 MM [.937 INCH ]
Packaging Features Packaging Method : Bag Packaging Quantity : 1000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Request a Quote
Email Supplier
Datasheet
Suppliers
Contact Features Contact Mating Area Plating Material Thickness : 3.81 - 6.35 MICM [150 - 250 MICIN ] Contact Underplating Material : Copper Contact Underplating Material Thickness : 2.54 MICM [100 MICIN ] Mating Tab Thickness : .81 MM [.032 INCH ] Mating Tab Width : 6.35 MM [.25 INCH ] PCB Contact Termination Area Plating Material Thickness : 3.81 - 6.35 MICM [150 - 250 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin Terminal Size : 6.35
Dimensions PCB Thickness (Recommended) : 1.57 - 2.39 MM [.062 - .094 INCH ] Profile Height from PCB : 23.7 MM [.937 INCH ]
Packaging Features Packaging Method : Bag Packaging Quantity : 1000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Contact Features
- Contact Mating Area Plating Material Thickness : 3.81 - 6.35 MICM [150 - 250 MICIN ]
- Contact Underplating Material : Copper
- Contact Underplating Material Thickness : 2.54 MICM [100 MICIN ]
- Mating Tab Thickness : .81 MM [.032 INCH ]
- Mating Tab Width : 6.35 MM [.25 INCH ]
- PCB Contact Termination Area Plating Material Thickness : 3.81 - 6.35 MICM [150 - 250 MICIN ]
- PCB Terminal Type : Tab
- Terminal Orientation : Straight
- Terminal Plating Material : Tin
- Terminal Size : 6.35
Dimensions
- PCB Thickness (Recommended) : 1.57 - 2.39 MM [.062 - .094 INCH ]
- Profile Height from PCB : 23.7 MM [.937 INCH ]
Packaging Features
- Packaging Method : Bag
- Packaging Quantity : 1000
Termination Features
- Product Terminates To : Printed Circuit Board
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Insulation Option : Uninsulated
- Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
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Datasheet
Technical Specifications
|
Product Category
|
Wire Terminals |
|
Product Number
|
62262-1 |
|
Product Name
|
PCB Terminals |
|
Material
|
Tin
|
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