Body Features Connector Profile : Low Ejector Location : None Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : DRAM
Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 144 Number of Rows : 2
Contact Features Contact Base Material : Phosphor Bronze Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Tin
Dimensions Row-to-Row Spacing : 5.4 MM [.21 INCH ] Stack Height : 5.2 MM [.205 INCH ]
Electrical Characteristics DRAM Voltage (V) : 3.3
Housing Features Centerline (Pitch) : .8 MM [.031 INCH ] Housing Color : Natural Housing Material : High Temperature Plastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Offset Left PCB Mount Retention : With PCB Mount Retention Type : Solder Tail
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tray, Box Packaging Quantity : 270
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Small Outline (SO)
Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Body Features
- Connector Profile : Low
- Ejector Location : None
- Latch Material : Stainless Steel
- Latch Plating Material : Tin
- Module Key Type : DRAM
Configuration Features
- Module Orientation : Right Angle
- Number of Bays : 2
- Number of Keys : 1
- Number of Positions : 144
- Number of Rows : 2
Contact Features
- Contact Base Material : Phosphor Bronze
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
- Memory Socket Type : Memory Card
- PCB Contact Termination Area Plating Material : Tin
Dimensions
- Row-to-Row Spacing : 5.4 MM [.21 INCH ]
- Stack Height : 5.2 MM [.205 INCH ]
Electrical Characteristics
Housing Features
- Centerline (Pitch) : .8 MM [.031 INCH ]
- Housing Color : Natural
- Housing Material : High Temperature Plastic
Industry Standards
- UL Flammability Rating : UL 94V-0
Mechanical Attachment
- Connector Mounting Type : Board Mount
- Mating Alignment Type : Offset Left
- PCB Mount Retention : With
- PCB Mount Retention Type : Solder Tail
Operation/Application
- Circuit Application : Signal
Packaging Features
- Packaging Method : Tray, Box
- Packaging Quantity : 270
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Cable-to-Board
- DRAM Type : Small Outline (SO)
Termination Features
- Insertion Style : Cam-In
- Termination Method to PCB : Surface Mount
Usage Conditions
- Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
