TE Connectivity Wire-to-Board Connector Contacts 583854-3

Contact Features Contact Base Material : Phosphor Bronze Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Retention Within Housing : With Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness (MICIN) : 30 Wire Contact Termination Area Plating Material : Tin Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Mechanical Attachment Contact Retention Type Within Housing : Locking Lance Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Loose Piece Packaging Quantity : 5000 Product Type Features Connector & Contact Terminates To : Wire & Cable Connector System : Wire-to-Board Termination Features Termination Method to Wire & Cable : Solder Eyelet