TE Connectivity Wire-to-Board Connector Contacts 583294-2

Description
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 15 Contact Type : Tab Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Loose Piece Packaging Quantity : 5000 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Board Sealable : No
  • Wire-to-Board Connector Contacts - 583294-2 - TE Connectivity
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Description
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 15 Contact Type : Tab Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Loose Piece Packaging Quantity : 5000 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Board Sealable : No
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Suppliers

Company
Product
Description
Supplier Links
Wire-to-Board Connector Contacts - 583294-2 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
Wire-to-Board Connector Contacts
583294-2
Wire-to-Board Connector Contacts 583294-2
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 15 Contact Type : Tab Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Loose Piece Packaging Quantity : 5000 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Board Sealable : No

Contact Features


  • Contact Base Material : Phosphor Bronze
  • Contact Current Rating (Max) (AMP) : 5
  • Contact Mating Area Plating Material : Gold
  • Contact Mating Area Plating Material Thickness (MICIN) : 15
  • Contact Type : Tab
  • Contact Underplating Material : Nickel
  • PCB Contact Termination Area Plating Material : Tin

Operation/Application


  • Circuit Application : Power & Signal

Packaging Features


  • Packaging Method : Loose Piece
  • Packaging Quantity : 5000

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Wire-to-Board
  • Sealable : No
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Technical Specifications

  TE Connectivity
Product Category Wire Terminals
Product Number 583294-2
Product Name Wire-to-Board Connector Contacts
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