TE ConnectivityHard Metric Backplane Connectors5636120-9
Description
Configuration Features Backplane Architecture : Mezzanine Number of Columns : 6 Number of Positions : 60 Number of Rows : 12 PCB Mount Orientation : Vertical Rows Loaded : Fully Loaded
Contact Features CompactPCI Designation : None Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : .7 Contact Mating Area Length (MM) : 8.2 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .05 MICM [2 MICIN ] Contact Type : Pin Contact Underplating Material : Nickel Feedthrough Post Length (MM) : 3.7 PCB Contact Termination Area Plating Material : Tin
Dimensions Backplane Module Length (MM) : 23.88
Housing Features Centerline (Pitch) : 2 MM [.078 INCH ] Housing Color : Black Housing Material : Polyester - GF
Industry Standards AdvancedTCA Specified Product : No
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal Shielded : No
Packaging Features Packaging Method : Package Packaging Quantity : 23
Product Type Features Backplane Interface Type : 2mm HM Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Header Sealable : No
Signal Characteristics Crosstalk Version : Standard Data Rate (GBS) : ≤1
Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
TE Connectivity
Done
Request a Quote
Email Supplier
Description
Configuration Features Backplane Architecture : Mezzanine Number of Columns : 6 Number of Positions : 60 Number of Rows : 12 PCB Mount Orientation : Vertical Rows Loaded : Fully Loaded
Contact Features CompactPCI Designation : None Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : .7 Contact Mating Area Length (MM) : 8.2 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .05 MICM [2 MICIN ] Contact Type : Pin Contact Underplating Material : Nickel Feedthrough Post Length (MM) : 3.7 PCB Contact Termination Area Plating Material : Tin
Dimensions Backplane Module Length (MM) : 23.88
Housing Features Centerline (Pitch) : 2 MM [.078 INCH ] Housing Color : Black Housing Material : Polyester - GF
Industry Standards AdvancedTCA Specified Product : No
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal Shielded : No
Packaging Features Packaging Method : Package Packaging Quantity : 23
Product Type Features Backplane Interface Type : 2mm HM Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Header Sealable : No
Signal Characteristics Crosstalk Version : Standard Data Rate (GBS) : ≤1
Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Configuration Features Backplane Architecture : Mezzanine Number of Columns : 6 Number of Positions : 60 Number of Rows : 12 PCB Mount Orientation : Vertical Rows Loaded : Fully Loaded
Contact Features CompactPCI Designation : None Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : .7 Contact Mating Area Length (MM) : 8.2 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .05 MICM [2 MICIN ] Contact Type : Pin Contact Underplating Material : Nickel Feedthrough Post Length (MM) : 3.7 PCB Contact Termination Area Plating Material : Tin
Dimensions Backplane Module Length (MM) : 23.88
Housing Features Centerline (Pitch) : 2 MM [.078 INCH ] Housing Color : Black Housing Material : Polyester - GF
Industry Standards AdvancedTCA Specified Product : No
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal Shielded : No
Packaging Features Packaging Method : Package Packaging Quantity : 23
Product Type Features Backplane Interface Type : 2mm HM Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Header Sealable : No
Signal Characteristics Crosstalk Version : Standard Data Rate (GBS) : ≤1
Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Configuration Features
Backplane Architecture : Mezzanine
Number of Columns : 6
Number of Positions : 60
Number of Rows : 12
PCB Mount Orientation : Vertical
Rows Loaded : Fully Loaded
Contact Features
CompactPCI Designation : None
Contact Base Material : Phosphor Bronze
Contact Current Rating (Max) (AMP) : .7
Contact Mating Area Length (MM) : 8.2
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : .05 MICM [2 MICIN ]
Contact Type : Pin
Contact Underplating Material : Nickel
Feedthrough Post Length (MM) : 3.7
PCB Contact Termination Area Plating Material : Tin
Dimensions
Backplane Module Length (MM) : 23.88
Housing Features
Centerline (Pitch) : 2 MM [.078 INCH ]
Housing Color : Black
Housing Material : Polyester - GF
Industry Standards
AdvancedTCA Specified Product : No
Mechanical Attachment
Connector Mounting Type : Board Mount
Operation/Application
Circuit Application : Signal
Shielded : No
Packaging Features
Packaging Method : Package
Packaging Quantity : 23
Product Type Features
Backplane Interface Type : 2mm HM
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Board-to-Board
PCB Connector Assembly Type : PCB Mount Header
Sealable : No
Signal Characteristics
Crosstalk Version : Standard
Data Rate (GBS) : ≤1
Termination Features
Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Usage Conditions
Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
