Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Gold Flash
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Package Packaging Quantity : 25
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -65 - 125 DEGC [-85 - 257 DEGF ]
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Description
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Gold Flash
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Package Packaging Quantity : 25
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -65 - 125 DEGC [-85 - 257 DEGF ]
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Gold Flash
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Package Packaging Quantity : 25
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -65 - 125 DEGC [-85 - 257 DEGF ]
Contact Features
Contact Base Material : Phosphor Bronze
Contact Current Rating (Max) (AMP) : 3
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ]
Contact Orientation : Straight
Contact Type : Socket
PCB Contact Termination Area Plating Material : Gold Flash
Mechanical Attachment
PCB Mount Retention : Without
Wire Insulation Support : Without
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Package
Packaging Quantity : 25
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to PCB : Through Hole - Solder
Usage Conditions
Operating Temperature Range : -65 - 125 DEGC [-85 - 257 DEGF ]
