Contact Features Contact Base Material : Phosphor Bronze Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : With Contact Type : Socket Contact Underplating Material : Tin Wire Contact Termination Area Plating Material : Tin-Lead Wire Contact Termination Area Plating Thickness : 2.54 MICM [100 MICIN ]
Dimensions Compatible Insulation Diameter Range : 1.02 - 2.03 MM [.04 - .08 INCH ] Wire Size (MMSQ) : .2 - .6 Wire Size (AWG) : 24 - 20
Mechanical Attachment Carrier Strip Mount Orientation : Side Feed Contact Retention Type Within Housing : Snap-In Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Strip Packaging Quantity : 6000
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
TE Connectivity
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Description
Contact Features Contact Base Material : Phosphor Bronze Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : With Contact Type : Socket Contact Underplating Material : Tin Wire Contact Termination Area Plating Material : Tin-Lead Wire Contact Termination Area Plating Thickness : 2.54 MICM [100 MICIN ]
Dimensions Compatible Insulation Diameter Range : 1.02 - 2.03 MM [.04 - .08 INCH ] Wire Size (MMSQ) : .2 - .6 Wire Size (AWG) : 24 - 20
Mechanical Attachment Carrier Strip Mount Orientation : Side Feed Contact Retention Type Within Housing : Snap-In Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Strip Packaging Quantity : 6000
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Contact Features Contact Base Material : Phosphor Bronze Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : With Contact Type : Socket Contact Underplating Material : Tin Wire Contact Termination Area Plating Material : Tin-Lead Wire Contact Termination Area Plating Thickness : 2.54 MICM [100 MICIN ]
Dimensions Compatible Insulation Diameter Range : 1.02 - 2.03 MM [.04 - .08 INCH ] Wire Size (MMSQ) : .2 - .6 Wire Size (AWG) : 24 - 20
Mechanical Attachment Carrier Strip Mount Orientation : Side Feed Contact Retention Type Within Housing : Snap-In Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Strip Packaging Quantity : 6000
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Contact Features
Contact Base Material : Phosphor Bronze
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ]
Contact Orientation : Straight
Contact Retention Within Housing : With
Contact Type : Socket
Contact Underplating Material : Tin
Wire Contact Termination Area Plating Material : Tin-Lead
