Configuration Features Compatible With Wire & Cable Type : FFC
Contact Features Contact Mating Area Plating Material : Gold Flash Contact Type : Splicing Contact PCB Contact Termination Area Plating Material : Tin-Lead
Packaging Features Packaging Method : Strip
Termination Features Termination Method to Wire & Cable : Insulation Displacement (IDC)
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
TE Connectivity
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Description
Configuration Features Compatible With Wire & Cable Type : FFC
Contact Features Contact Mating Area Plating Material : Gold Flash Contact Type : Splicing Contact PCB Contact Termination Area Plating Material : Tin-Lead
Packaging Features Packaging Method : Strip
Termination Features Termination Method to Wire & Cable : Insulation Displacement (IDC)
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Configuration Features Compatible With Wire & Cable Type : FFC
Contact Features Contact Mating Area Plating Material : Gold Flash Contact Type : Splicing Contact PCB Contact Termination Area Plating Material : Tin-Lead
Packaging Features Packaging Method : Strip
Termination Features Termination Method to Wire & Cable : Insulation Displacement (IDC)
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Configuration Features
Compatible With Wire & Cable Type : FFC
Contact Features
Contact Mating Area Plating Material : Gold Flash
Contact Type : Splicing Contact
PCB Contact Termination Area Plating Material : Tin-Lead
Packaging Features
Packaging Method : Strip
Termination Features
Termination Method to Wire & Cable : Insulation Displacement (IDC)
Usage Conditions
Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]