Body Features Contact Removal Style : Rear Release/Rear Remove Shell Base Material : Brass Shell Plating Material : Gold
Contact Features Contact Base Material : Beryllium Copper Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Orientation : Straight Contact Size : Size 8 Contact Type : Pin
Identification Marking Contact Color Code : None
Mechanical Attachment Contact Retention Type Within Housing : Snap-In
Other Dielectric Material : Polytetrafluoroethyl
ene (PTFE)
Packaging Features Packaging Method : Package
Product Type Features Connector & Contact Terminates To : Printed Circuit Board RF Contact Style : Coax
Termination Features Termination Method to PCB : Through Hole - Solder
TE Connectivity
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Description
Body Features Contact Removal Style : Rear Release/Rear Remove Shell Base Material : Brass Shell Plating Material : Gold
Contact Features Contact Base Material : Beryllium Copper Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Orientation : Straight Contact Size : Size 8 Contact Type : Pin
Identification Marking Contact Color Code : None
Mechanical Attachment Contact Retention Type Within Housing : Snap-In
Other Dielectric Material : Polytetrafluoroethyl
ene (PTFE)
Packaging Features Packaging Method : Package
Product Type Features Connector & Contact Terminates To : Printed Circuit Board RF Contact Style : Coax
Termination Features Termination Method to PCB : Through Hole - Solder
Body Features Contact Removal Style : Rear Release/Rear Remove Shell Base Material : Brass Shell Plating Material : Gold
Contact Features Contact Base Material : Beryllium Copper Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Orientation : Straight Contact Size : Size 8 Contact Type : Pin
Identification Marking Contact Color Code : None
Mechanical Attachment Contact Retention Type Within Housing : Snap-In
Other Dielectric Material : Polytetrafluoroethyl
ene (PTFE)
Packaging Features Packaging Method : Package
Product Type Features Connector & Contact Terminates To : Printed Circuit Board RF Contact Style : Coax
Termination Features Termination Method to PCB : Through Hole - Solder
Body Features
Contact Removal Style : Rear Release/Rear Remove
Shell Base Material : Brass
Shell Plating Material : Gold
Contact Features
Contact Base Material : Beryllium Copper
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Contact Orientation : Straight
Contact Size : Size 8
Contact Type : Pin
Identification Marking
Contact Color Code : None
Mechanical Attachment
Contact Retention Type Within Housing : Snap-In
Other
Dielectric Material : Polytetrafluoroethylene (PTFE)
Packaging Features
Packaging Method : Package
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
