Body Features Primary Product Color : Brown
Configuration Features Board-to-Board Configuration : Perpendicular Number of Loaded Positions : 210 Number of Positions : 210 Number of Rows : 3 PCB Mount Orientation : Vertical Stackable : No
Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 3 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Type : Socket Mating Square Post Dimension : .64 MM [.025 INCH ] PCB Contact Termination Area Plating Material : Tin-Lead PCB Contact Termination Area Plating Material Thickness (MICIN) : 150
Dimensions Connector Height : 11.43 MM [.45 INCH ] Connector Width : 12.44 MM [.49 INCH ] PCB Thickness (Recommended) : 2.44 MM [.096 INCH ] Row-to-Row Spacing : 2.54 MM [.1 INCH ] Stack Height : 15.24 MM [.6 INCH ]
Housing Features Centerline (Pitch) : 2.54 MM [.1 INCH ] Housing Material : Polyphenylene Sulfide (PPS)
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Polarized PCB Mount Alignment : With PCB Mount Retention : With PCB Mount Retention Type : Mounting Hole
Operation/Applicatio
n Circuit Application : Signal Solder Process Feature : Board Standoff
Packaging Features Packaging Quantity : 1 Packaging Type : Package
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Receptacle Sealable : No
Termination Features Rectangular Termination Post & Tail Thickness : .81 MM [.032 INCH ] Rectangular Termination Post & Tail Width : 1.12 MM [.044 INCH ] Termination Method to Printed Circuit Board : Through Hole - Solder Termination Post & Tail Length : 5.84 MM [.23 INCH ]
Usage Conditions Operating Temperature Range : -65 - 125 DEGC [-85 - 257 DEGF ]
TE Connectivity
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Description
Body Features Primary Product Color : Brown
Configuration Features Board-to-Board Configuration : Perpendicular Number of Loaded Positions : 210 Number of Positions : 210 Number of Rows : 3 PCB Mount Orientation : Vertical Stackable : No
Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 3 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Type : Socket Mating Square Post Dimension : .64 MM [.025 INCH ] PCB Contact Termination Area Plating Material : Tin-Lead PCB Contact Termination Area Plating Material Thickness (MICIN) : 150
Dimensions Connector Height : 11.43 MM [.45 INCH ] Connector Width : 12.44 MM [.49 INCH ] PCB Thickness (Recommended) : 2.44 MM [.096 INCH ] Row-to-Row Spacing : 2.54 MM [.1 INCH ] Stack Height : 15.24 MM [.6 INCH ]
Housing Features Centerline (Pitch) : 2.54 MM [.1 INCH ] Housing Material : Polyphenylene Sulfide (PPS)
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Polarized PCB Mount Alignment : With PCB Mount Retention : With PCB Mount Retention Type : Mounting Hole
Operation/Applicatio
n Circuit Application : Signal Solder Process Feature : Board Standoff
Packaging Features Packaging Quantity : 1 Packaging Type : Package
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Receptacle Sealable : No
Termination Features Rectangular Termination Post & Tail Thickness : .81 MM [.032 INCH ] Rectangular Termination Post & Tail Width : 1.12 MM [.044 INCH ] Termination Method to Printed Circuit Board : Through Hole - Solder Termination Post & Tail Length : 5.84 MM [.23 INCH ]
Usage Conditions Operating Temperature Range : -65 - 125 DEGC [-85 - 257 DEGF ]
Body Features Primary Product Color : Brown
Configuration Features Board-to-Board Configuration : Perpendicular Number of Loaded Positions : 210 Number of Positions : 210 Number of Rows : 3 PCB Mount Orientation : Vertical Stackable : No
Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 3 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Type : Socket Mating Square Post Dimension : .64 MM [.025 INCH ] PCB Contact Termination Area Plating Material : Tin-Lead PCB Contact Termination Area Plating Material Thickness (MICIN) : 150
Dimensions Connector Height : 11.43 MM [.45 INCH ] Connector Width : 12.44 MM [.49 INCH ] PCB Thickness (Recommended) : 2.44 MM [.096 INCH ] Row-to-Row Spacing : 2.54 MM [.1 INCH ] Stack Height : 15.24 MM [.6 INCH ]
Housing Features Centerline (Pitch) : 2.54 MM [.1 INCH ] Housing Material : Polyphenylene Sulfide (PPS)
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Polarized PCB Mount Alignment : With PCB Mount Retention : With PCB Mount Retention Type : Mounting Hole
Operation/Applicatio
n Circuit Application : Signal Solder Process Feature : Board Standoff
Packaging Features Packaging Quantity : 1 Packaging Type : Package
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Receptacle Sealable : No
Termination Features Rectangular Termination Post & Tail Thickness : .81 MM [.032 INCH ] Rectangular Termination Post & Tail Width : 1.12 MM [.044 INCH ] Termination Method to Printed Circuit Board : Through Hole - Solder Termination Post & Tail Length : 5.84 MM [.23 INCH ]
Usage Conditions Operating Temperature Range : -65 - 125 DEGC [-85 - 257 DEGF ]
Body Features
Primary Product Color : Brown
Configuration Features
Board-to-Board Configuration : Perpendicular
Number of Loaded Positions : 210
Number of Positions : 210
Number of Rows : 3
PCB Mount Orientation : Vertical
Stackable : No
Contact Features
Contact Base Material : Beryllium Copper
Contact Current Rating (Max) (AMP) : 3
Contact Layout : Matrix
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Contact Type : Socket
Mating Square Post Dimension : .64 MM [.025 INCH ]
PCB Contact Termination Area Plating Material : Tin-Lead
PCB Contact Termination Area Plating Material Thickness (MICIN) : 150
Dimensions
Connector Height : 11.43 MM [.45 INCH ]
Connector Width : 12.44 MM [.49 INCH ]
PCB Thickness (Recommended) : 2.44 MM [.096 INCH ]
Row-to-Row Spacing : 2.54 MM [.1 INCH ]
Stack Height : 15.24 MM [.6 INCH ]
Housing Features
Centerline (Pitch) : 2.54 MM [.1 INCH ]
Housing Material : Polyphenylene Sulfide (PPS)
Industry Standards
UL Flammability Rating : UL 94V-0
Mechanical Attachment
Connector Mounting Type : Board Mount
Mating Alignment : With
Mating Alignment Type : Polarized
PCB Mount Alignment : With
PCB Mount Retention : With
PCB Mount Retention Type : Mounting Hole
Operation/Application
Circuit Application : Signal
Solder Process Feature : Board Standoff
Packaging Features
Packaging Quantity : 1
Packaging Type : Package
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Board-to-Board
PCB Connector Assembly Type : PCB Mount Receptacle
Sealable : No
Termination Features
Rectangular Termination Post & Tail Thickness : .81 MM [.032 INCH ]
Rectangular Termination Post & Tail Width : 1.12 MM [.044 INCH ]
Termination Method to Printed Circuit Board : Through Hole - Solder
Termination Post & Tail Length : 5.84 MM [.23 INCH ]
Usage Conditions
Operating Temperature Range : -65 - 125 DEGC [-85 - 257 DEGF ]